Dupont Connector & Wire Plating Chemistries
Seacole offers DuPont’s line of metal finishing products. Find the right product for your connector or wire plating process.
DuPont products include solutions for solderless connections, inkjet masking for selective plating of gold contacts, and cost-effective alternatives to gold finishes that will not sacrifice performance. Seacole also offers a wide variety of cleaners, surface treatments, and strippers to enhance metal finish performance.
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Featured Wire Plating Products
Solderon™ MHS-W
FOR WIRE PLATING
Solderon™ MHS-W is a high-speed, non-foaming electroplating product for the rapid deposition of fine-grain, matte tin, and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in reel-to-reel wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems.
- Based on a biodegradable acid, readily achieve effluent treatment with standard neutralization and filtration procedures
- Non-foaming electrolyte
- Non-fluoborate
- High achievable deposition rates
- Excellent thickness distribution and alloy stability over a wide current density range
Ronaclean™ E 950 LF
FOR WIRE PLATING
Ronaclean™ E 950 LF is an economical, low-foaming, high-detergent alkaline cleaner especially designed for high-speed applications.
- Low foaming
- High detergency
- Excellent primary cleaning of most metals
- Compatible with hard water
- Maintains detergency for long periods of time
- Non-chelated for simple waste treatment
Ronaclean™ 500
FOR WIRE PLATING
Ronaclean™ 500 Liquid Alkaline Cleaner is designed to degrease and clean contaminated surfaces of iron, steel, copper, and copper alloys. It can be used as a soak cleaner or as an electrolytic degreaser capable of removing oils and lubricants, such as cutting fluids used in machining and metal forming.
- Low make-up concentration
- Liquid concentrate eliminates need to dissolve salts
- Diluted solution is ready for immediate use
- No sticking of particles to tanks, pumps, or recuperators.
Featured Connector Plating Products
Solderon™ BHT-350 Bright Tin
FOR CONNECTOR PLATING
Solderon™ BHT-350 Bright Tin is a high-speed, sulphonate–based tin electroplating product formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. Solderon™ BHT-350 Bright Tin electrolyte is free of volatile aldehydes and may be operated at temperatures up to 50°C.
- High operating temperature enables high plating rates and reduces volume increase
- Excellent brightness and solderability over a broad current density range
- Low carbon content in the deposit
- High ductility of the deposit
- Low foaming electrolyte
- Consistent and stable surface morphology
Ronovel™ CM
FOR CONNECTOR PLATING
RONOVEL™ CM utilizes a unique chelate system which prevents the oxidation of cobalt and substantially reduces the variation in cobalt co-deposition with respect to current density. It provides the user with total flexibility of operation. Processes can easily be tailored to suit different plating heads/cells by adjustment of the operating parameters. RONOVEL™ CM Cobalt-Alloyed Electrolytic Gold is designed for low- and high-speed plating applications, e.g. reel-to-reel connector, stripe or strip, automatic printed circuit tab, deep tank circuit, and barrel plating. RONOVEL™ CM Cobalt-Alloyed Electrolytic Gold should be used where a highly even thickness distribution across the plated part is desired.
- Wide operating current density range
- Reduced deposit porosity
- Low gold metal concentration
- Stable cobalt content over wide current density range
- Superior wear resistance
- Excellent throwing power
