ENVIRO/Flow HAL-40 LV (HAL-40 LV) is a modified version of HAL-40, exhibiting a slightly lower viscosity to improve copper coverage on very small features. Like its counterpart, HAL-40 LV is designed to assure rapid and complete soldering of printed wiring boards processed through ArgusTM vertical hot air leveling equipment. ENVIRO/Flow HAL-40 LV will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize copper reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-40 LV will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-40 LV is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators that could attack solder mask or the laminate buttercoat.
- HAL-40 LV removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
- HAL-40 LV is a lower viscosity version of HAL-40, to ease flux application on printed circuit boards exhibiting very small features, thereby improve coverage and minimize tailings.
- HAL-40 LV reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
- HAL-40 LV is a low acid formulation minimizing equipment wear.