Cu/ETCH ME-45 | Seacole

Cu/ETCH ME-45

Cu/ETCH ME-45 is a highly stable, easy to operate copper microetchant. It is an excellent micro etch for use prior to dry film lamination, oxide coating, electroless plating or solder leveling. Long bath life can be obtained by replenishment based on simple chemical analysis. ME-45 can be operated in either immersion or spray equipment.


Performance Features

  • Highly Stable
  • Economical
  • Long Bath Life
  • Formulated for either Immersion or Spray Equipment

 

Cu/ETCH ME-45