Dow Palladure 200

The Palladure 200 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for electronic applications from a mildly alkaline, ammoniacal electrolyte.

Typical applications include electronic connectors, printed circuit edge tabs and semiconductor components. For connector applications, the benefits of palladium coatings can be enhanced by using a palladium nickel underplate. The palladium-nickel/palladium composite exhibits superior corrosion resistance and ductility. The palladium/gold flash compositee exhibits excellent wear resistance and is a suitable replacement for hard gold.

For semiconductor components, thin palladium coatings are suitable as a bondable surface, replacing silver on the inner leads and pads of devices, and as a solderable coating on the external leads replacing tin-lead.

Product Features

  • Low porosity electrodeposits offer excellent protection against base metal/undercoat oxidation and corrosion
  • Excellent wire bonding characteristics in semiconductor applications
  • Thin coatings function well as a solderable finish
  • Low, stable contact resistance and very good wear resistance in connector applications when used in conjunction with a thin gold flash top coat

Link to Dow Palladure 200


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