Seacole Product Tag: Surface Finishing


Metal Chem Meta-Plate UCB

The Ultimate Connector Bath “A LEAD AND CADMIUM FREE MEDIUM PHOSPHORUS, SEMI-BRIGHT, DUCTILE, HIGH SPEED, SELF-pH REGULATING ELECTROLESS NICKEL BATH” [Read More]

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Metal Chem Meta-Mate Zincate 40

META-MATE ZINCATE 40 is a cyanide free dilute zincate process for processing aluminum and its alloys. META-MATE ZINCATE 40 removes [Read More]

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Hubbard Hall Lusterclean 11L

Lusterclean™ 11 L is a liquid concentrate which may be used as an electrolytic cleaner, soak cleaner or cleaner/de-ruster of [Read More]

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Dow Photoposit SN 68H Photoresist

Link to Dow Photoposit SN 68H PhotoPhotoposit SN 68H Photoresist, developed to address industry demands for a robust, high-yielding, fine-line, [Read More]

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Dow Tinposit LF Immersion Tin

Tinposit LF Immersion Tin is an immersion tin formulation producing uniform and solderable tin deposits on properly prepared PWB substrates. [Read More]

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Dow Preposit Etch 748

For use in the Circuposit 3000 Process. Preposit Etch 748 is a mildly-acidic micro-etch that promotes excellent copper innerlayer adhesion. [Read More]

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Dow Copper Gleam RG 11

Copper Gleam RG 11 Acid Copper Plating Process is designed for rack, barrel, and reel-to-reel applications. The deposits obtained are [Read More]

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Dow Ronaclean E950 LF

Ronaclean E950 is an economical, low-foaming, high-detergent alkaline cleaner especially designed for high-speed applications. The best results are obtained when [Read More]

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Dow Neutra Rinse 80

Neutra Rinse 80 process will neutralize acidic films remaining on tin and tin-lead plated parts. The removal of these films [Read More]

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Dow Neutra-Clean 68

Neutra-Clean 68 Soak Cleaner is a neutral pH soak cleaner used to clean nonferrous metal surfaces prior to plating operations [Read More]

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Dow Neutralizer PM-952

Neutralizer PM-952 may be used with the Crownplate Process or PM System for plating-on-plastics and specifically for plating Noryl straight [Read More]

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Dow Nickel Gleam BR 220

Nickel Gleam BR 220 is a bright nickel plating process. It was developed to meet the high performance requirements demanded [Read More]

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Dow Niposit 428 Nickel Stripper

Niposit 428 Nickel Stripper is a stable, non-cyanide product designed to remove electroless and most electroplated nickel deposits from ferrous [Read More]

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Dow Palladure 200

The Palladure 200 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for [Read More]

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Dow Palladure 500

The Palladure 500 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for [Read More]

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Dow Pallamet 500 Palladium-Nickel

The Pallamet 500 Palladium-Nickel Electrolyte produces bright, ductile palladium-nickel deposits of approximately 80% Pd/20% Ni from a sulfate-based (chloride-free) system. [Read More]

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Dow Ronaclean E950

Ronaclean E950 is an economical, heavy-duty, high-detergent alkaline cleaner especially designed for wire applications. The best results are obtained when [Read More]

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Dow Tinposit LT-26 Immersion Tin

Tin is deposited onto copper, copper-based alloys and tin/lead electroplate by simple immersion in the Tinposit LT-26 Immersion Tin plating [Read More]

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Dow Ronastan TP-SR

The Ronastan TP-SR electroplating process is specifically formulated for use in high-speed continuous steel strip tin plating operations. Product Features [Read More]

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Dow Silver Strip LR-525

Silver Strip LR-525 is an alkaline non-cyanide electrolytic stripping process designed for removal of silver flash from copper and copper [Read More]

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Dow Solderon BI MH-400

Solderon Bi MH-400 is a lead-free, organic sulfonate electroplating process for the high-speed deposition of uniform, fine grain, matte tin-bismuth [Read More]

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Dow Ronaclean E950

Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonite electrolyte. Fully-solderable deposits [Read More]

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Dow Solderon ST-200

Solderon ST-200 is a low-foaming, organic sulfonate electroplating process for the high-and low-speed deposition of uniform, large, well-polygonized grain tin [Read More]

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Dow Solderon ST-380

Solderon ST-380 is a high-speed, sulphonate-based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines [Read More]

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Dow Aurall 364-A Strike Bath

Aurall 364-A Strike Bath is designed to plate thin, adherent, pure gold electrodeposits onto copper, nickel and nickel alloys. Product [Read More]

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Dow Cataposit PM-959 Catalyst

Cataposit PM-959 Catalyst has been specifically formulated for plating on plastics. Cataposit PM-959 Catalyst has been proven to work successfully [Read More]

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Dow Aurolectroless SMT 520 Immersion Gold

Aurolectroless SMT 520 Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and [Read More]

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Solderon BP TS 4000 Matte Tin/Silver

Solderon BP TS 4000 Matte Tin/Silver bump plating bath is a low-foaming, organic sulfonate-based electrolyte for the high-speed deposition of [Read More]

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Dow Solderon MHS-W

Solderon MHS-W is a high-speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy [Read More]

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Dow KADIZID

The Kadizid process produces bright cadmium electrodeposits directly from an acid bath. The brightness of the deposit is comparable to [Read More]

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Dow Solder Strip 8T

Solder Strip 8T is designed to strip both tin and tin-lead alloys rapidly from copper and its alloys. Link to [Read More]

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Dow Solderon BHT-350 Bright Tin

Solderon BHT-350 Bright Tin is a high speed, sulphonate-based tin electroplating product formulated for continuous electroplating of wire and connector [Read More]

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Dow Niposit PM-988

Niposit PM-988 is a low-temperature electroless nickel process specifically designed for a variety of “plating on plastics” applications. The Niposit [Read More]

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Dow Tinglo Culmo Bright Acid Tin Electroplating

The Tinglo Culmo Process offers extremely bright tin deposits with excellent solderability and ductility, capable of meeting the requirements for [Read More]

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Dow Silver Glo 3KBP

The Rohm and Haas Electronic Materials Silver Glo 3KBP process is designed to produce bright silver deposits over a wide [Read More]

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Dow Solderon BT-280

Solderon BT-280 is a high-speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. [Read More]

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Dow Solderon BT-150

Solderon BT-150 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel [Read More]

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Dow No Tarn PM-3 Silver Antitarnish

No Tarn PM-3 Silver Antitarnish bath was specifically developed for protection of silver from sulphidation. It is based on aqueous, [Read More]

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Dow Neutralizer PM-954

Neutralizer PM-954 is used in the Crownplate Process and PM System for plating-on-plastics. When used after the rinses following chromic [Read More]

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Dow Niposit Nickel Stripper 424

Niposit Nickel Stripper 424 rapidly strips electroless nickel-phosphorus deposits from mild steel and steel alloys without substrate attack. Product Features [Read More]

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Dow Nickel Gleam EP

Nickel Gleam EP is a single-additive process designed to produce nickel-phosphorus alloy deposits over a wide range of current densities. [Read More]

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Dow Conductron DP Accelerator LC

Conductron DP Accelerator LC is designed to promote initially rapid and complete coverage at the subsequent electrolytic copper plating stage, [Read More]

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Dow CUPURE Cyanide Free Alkaline Copper Plating

CUPURE Cyanide Free Alkaline Copper is a plating product that is easy to maintain and offers semi-bright ductile deposits with [Read More]

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Dow Ronapol 200

Ronapol 200 is an anodic polish for copper and copper alloys, for example phosphor-bronze and beryllium-copper, giving smooth, brilliant surface [Read More]

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Dow Silveron GT-101 Silver Strike

Silveron GT-101 Silver Strike is an alkaline non-cyanide pure silver strike plate designed for use prior to the Silveron GT-101 [Read More]

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Intervia 2011 Remover

Intervia 2011 Remover is a mixture of pure organic solvents specifically formulated to remove all Microposit, Megaposit, and Intervia Photoresists. [Read More]

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Dow Silveron GT-101 Bright Silver

Silveron GT-101 Bright Silver is an alkaline non-cyanide pure silver electroplating electrolyte designed to produce bright silver deposits for various [Read More]

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Dow Silver Glo 3K

The Rohm and Haas Electronic Materials bright silver process 3K is a simplified process designed to produce bright silver deposits [Read More]

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SurTec 668

SurTec 668 is a chromium(VI)-free blue passivation for zinc that is suitable for all zinc processes. åÊIt has good corrosion [Read More]

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SurTec 555 S

Surtec 555 S can be applied in immersion and spray process. It is applicable for all kinds of passivation and [Read More]

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Surtec 650 chromitAL TCP

SurTec 650 chromitAL® is a chromium(VI)-free trivalent passivation for aluminium. The liquid concentrate delivers an excellent corrosion protection, comparable with [Read More]

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Hubbard Hall Black-Magic RT S 30

Room temperature blackening solution for powdered metal and steel with minimal smut generation. Black-Magic RT S 30 is very effective [Read More]

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Hubbard Hall Aquastrip ACB

Aquastrip ACB is a mildly acidic liquid concentrate, which is used to remove tenacious polymeric coatings including epoxy paints from [Read More]

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Hubbard Hall Aquaease SL 917

Aquaease™ SL 917 is low foam, heavy duty caustic, chelated alkaline soak, ultrasonic, electro, and spray cleaner for steel, stainless [Read More]

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Hubbard Hall Aquaease SL 689

Aquaease SL 689 is a liquid duty alkaline soak for cleaning ferrous metals, copper, magnesium alloys and brass alloys. Aquaease [Read More]

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