Dow Solderon BI MH-400

Solderon Bi MH-400 is a lead-free, organic sulfonate electroplating process for the high-speed deposition of uniform, fine grain, matte tin-bismuth alloy coatings.

Solderon Bi MH-400 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications.

Product Features

  • Environmentally-friendly, lead-free coating
  • Excellent solderability
  • Uniform deposit appearance
  • Excellent alloy stability
  • Low co-deposited organics

Link to Dow Solderon BI MH-400


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