Solderon Bi MH-400 is a lead-free, organic sulfonate electroplating process for the high-speed deposition of uniform, fine grain, matte tin-bismuth alloy coatings.
Solderon Bi MH-400 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications.
- Environmentally-friendly, lead-free coating
- Excellent solderability
- Uniform deposit appearance
- Excellent alloy stability
- Low co-deposited organics
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