Dow Ronaclean E950

Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonite electrolyte. Fully-solderable deposits can be plated with alloy compositions ranging from 60% through 95% tin. The process offers enhanced throwing power and low current density brightness.

Product Features

  • Non-fluoborate electrolyte
  • Excellent brightness
  • Fully-solderable deposits
  • Stable alloy and thickness distribution over the working current density range

Link to Dow Solderon BLS


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