Seacole Product Tag: Electronic Finishing Applications


Dow Nikal MP-200 (SE)

Rohm and Haas Electronic Materials Nikal MP-200 (SE) offers numerous advantages of precision high-speed nickel plating in the electronic, printed [Read More]

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Dow Palladure 500

The Palladure 500 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for [Read More]

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Dow Pallamet 500 Palladium-Nickel

The Pallamet 500 Palladium-Nickel Electrolyte produces bright, ductile palladium-nickel deposits of approximately 80% Pd/20% Ni from a sulfate-based (chloride-free) system. [Read More]

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Dow Ronaclean E950

Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonite electrolyte. Fully-solderable deposits [Read More]

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Dow Solderon ST-200

Solderon ST-200 is a low-foaming, organic sulfonate electroplating process for the high-and low-speed deposition of uniform, large, well-polygonized grain tin [Read More]

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Dow Solderon MHS-W

Solderon MHS-W is a high-speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy [Read More]

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Dow Tinglo Culmo Bright Acid Tin Electroplating

The Tinglo Culmo Process offers extremely bright tin deposits with excellent solderability and ductility, capable of meeting the requirements for [Read More]

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Dow Solderon BT-150

Solderon BT-150 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel [Read More]

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Dow No Tarn PM-3 Silver Antitarnish

No Tarn PM-3 Silver Antitarnish bath was specifically developed for protection of silver from sulphidation. It is based on aqueous, [Read More]

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Dow Conductron DP Accelerator LC

Conductron DP Accelerator LC is designed to promote initially rapid and complete coverage at the subsequent electrolytic copper plating stage, [Read More]

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Intervia 2011 Remover

Intervia 2011 Remover is a mixture of pure organic solvents specifically formulated to remove all Microposit, Megaposit, and Intervia Photoresists. [Read More]

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