Metal Chem Meta-Plate UCB

The Ultimate Connector Bath

“A LEAD AND CADMIUM FREE MEDIUM PHOSPHORUS, SEMI-BRIGHT, DUCTILE, HIGH SPEED, SELF-pH REGULATING ELECTROLESS NICKEL BATH”

Metal Chem’s META-PLATE UCB is an easy to use advanced Lead and Cadmium Free, Medium Phosphorus Electroless Nickel Process designed specifically to meet the requirements of aluminum connector and aerospace industries. With over 50 years of electroless nickel research and development experience, Metal Chem offers the META-PLATE UCB to meet and exceed the operational and performance qualities of all other competitive Medium Phosphorus EN chemistries in the marketplace. Among its many attributes, META-PLATE UCB is extremely user friendly, providing quality deposits and bath stability from a wide window of operation.

META-PLATE UCB is supplied as three separate liquid concentrates. META-PLATE UCB-MU is used for make-up; while META-PLATE UCB-A and META-PLATE UCB-C are used for replenishment.

META-PLATE UCB meets Mil-26074E, AMS 2404G, AMS 2405, and ASTM B733-04 specifications. META-PLATE UCB is compliant with ELV (automotive), RoHS requirement (electronics), WEEE (electronics) and the Green Initiative (all industries).

Features

  • No Lead or Cadmium
  • Self pH Regulating Replenishment
  • Exceptional Tank and Concentrate Stabilit
  • Excellent Copper Initiation
  • Exceptional Ductility
  • Consistent Pit-Free, Smooth Semi-Bright Deposits
  • RoHS, WEEE and ELV Compliant
  • Link to Meta-Plate UCB TDS

 

 


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ACP 157 Cationic Coagulant

ACP 157 is a liquid iron and calcium based aqueous high charge density inorganic/organic coagulant blend. The product is designed for use in both industrial and municipal wastewater treatment applications to improve the efficiency of liquid/solid separation processes.

ACP 157 performs well as a primary coagulant over a brad range of treatment applications. When extra weight is needed ACP 157 is known for its ability to increase hardness and aid in settling/dewatering solids. This product is effective at removing oil and grease because of its pH characteristics. ACP 157 is also particularly effective at reducing phosphate when used in conjunction with a lime slurry product (such as BF90C). ACP 157 can be used alone or in conjunction with one of the ACS Series of flocculants.

Link to ACP 157 TDS


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Metal Chem Meta-Black Midnite

META-BLACK MIDNITE is an easy to use liquid material designed to yield low reflectivity, matte black deposits. META-BLACK MIDNITE is a robust room temperature post dip that provides industry leading light absorbance when used with Meta-Plate 1200 electroless nickel system. The EN deposit must be clean and active prior to blackening to achieve the best results. META-BLACK MIDNITE creates a thin black nickel oxide film that is free of loose smut which will maintain integrity for over 50 hours Neutral Salt Spray Exposure (ASTM B117).

Product Features

  • Effective blackening agent
  • Low concentrations of oxidizers
  • One step process
  • Easily waste treated
  • Long blackening life
  • Lowest reflectivity black nickel deposit
  • Smut free coating
  • Optional seals for 1000 hour salt spray

Link to Metal Chem META-BLACK MIDNITE TDS

 


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Metal Chem Meta-Treat EN

Meta-Treat EN is a waste treatment additive for spent Metal-Chem Inc. electroless nickel solutions. This process reduces nickel metal levels from 6,000 ppm to below 5 ppm in 2-4 hours without creating sludge. The Meta-Treat EN process is simple, inexpensive and can be carried out in your EN tank thus eliminating the need to invest in costly waste treatment equipment.

The Meta-treat EN process eliminates serious liability risks EN platers assume when they have their spent solutions hauled away for treatment or ‰recycling. The Meta-Treat EN process is designed for use on all Metal Chem Electroless Nickel Plating baths.

Product Features

  • Effective removal of nickel
  • Quick and easy to implement
  • Treatment right in EN tank
  • Does not create a sludge
  • No hauling of spent baths

Link to Metal Chem Meta-Treat EN TDS


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Metal Chem Meta-Mate Zincate 40

META-MATE ZINCATE 40 is a cyanide free dilute zincate process for processing aluminum and its alloys. META-MATE ZINCATE 40 removes aluminum oxide and applies a thin zinc film on the aluminum alloy by immersion to prevent its re-oxidation. This film can then be electroplated with copper, nickel and certain other electrolytic processes as well as with electroless nickel. The dilute META-MATE ZINCATE 40 solution has low viscosity that rapidly penetrates the water film present on the cleaned aluminum. This new alloy process produces a denser, more uniform zinc film than what can be found with most other conventional zincates. This film has improved adhesion to the aluminum, helping to insure excellent adhesion of the subsequent plate.

 

Product Features

  • Promotes excellent adhesion of electroplated and electroless processes: eliminates rejects and improves quality.
  • Cyanide-free process: eliminates cost of waste treatment to destroy cyanide.
  • Improves surface conditioning: reduces necessity for double zincating.
  • Can be used in both rack and barrel installations: reduces number of materials to be stocked and handled; saves storage space.
  • Low dragout: economical to use.
  • Free rinsing: minimum carry-over of zincate into plating baths.
  • Uniform zinc coating on complex parts: excellent for plating screw threads, blind holes, grooves, porous castings.
  • Resists lateral corrosion: improved corrosion resistance at scratches, edges, etc.
  • Wide range of operating conditions: precise control not necessary.

Link to Metal Chem Meta-Mate Zincate 40 TDS


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Hubbard Hall Lusterclean 11L

Lusterclean™ 11 L is a liquid concentrate which may be used as an electrolytic cleaner, soak cleaner or cleaner/de-ruster of ferrous metals in either rack or barrel line. This product has the ability to split mineral based oils, thereby extending the life of the solution.

Product Features

  • Liquid form makes it easy to add. No dangerous splatters or dissolution problems
  • Oil splitting
  • May be used for rust and scale removal from steel
  • Low sludging
  • Free of cyanides, chromates, chlorinated, or hydrocarbon solvents
  • Silicate and phosphate free; ideal where heat-treating follows cleaning operations
  • Biodegradable surfactant systems

Hubbard Hall Lusterclean™


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Ricca Buffer, Precision Reference Standard, pH 3.000

Buffer, Precision Reference Standard, pH 3.000 – 0.002 at 25°C

Link to Ricca Buffer, pH 3.000

 

 


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Ricca Buffer, Precision Reference Standard, pH 2.000

Buffer, Precision Reference Standard, pH 2.000 – 0.002 at 25°C

Link to Buffer, Precision Reference Standard, pH 2.000


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Ricca Buffer, Reference Standard, ph 7.00

Buffer, Reference Standard, pH 7.00 – 0.01 at 25°C (Color Coded Yellow)

Link to Ricca Buffer, pH 7.00

 


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Link to Ricca Buffer, Precision Reference Standard, pH 4.00

Buffer, Precision Reference Standard, pH 4.000 – 0.002 at 25°C (Color Coded Red)

Link to Ricca Buffer, Precision Reference Standard


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ACS ACP 191 Cationic Coagulant

ACP 191 is an aqueous high charge density inorganic/organic cationic coagulant blend. The product is designed for use in both industrial and municipal wastewater treatment applications.

Product Features

  • ACP 191 is effective in treating metal finishing wastes containing heavy metals and printing waste containing water based inks.
  • It is especially good at removing hexavalent chrome and copper.
  • ACP 191 provides effluent clarity and improves the dewatering characteristics of most sludge.
  • ACP 191 can be used alone or in conjunction with one of the ACS Series of flocculants.

Link to ACP 191 Cationic Coagulant


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ACS AC 20 Cationic Coagulant

AC 20 is a liquid aluminum based inorganic cationic coagulant. The product is designed for use in a variety of industrial and municipal wastewater treatment applications.

Product Features

  • AC 20 is a very cost effective primary coagulant for use in liquid/solid separation.
  • It is especially effective at removing oil and grease because of its pH characteristics. AC 20 can be used alone or in conjunction with one of the ACS Series of flocculants, such as AP 720 to enhance floc size, density and sedimentation.

Link to ACS AC 20 Cationic Coagulant


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ACS AN 200 Metal Precipitant

AN 200 is a 40% aqueous solution of an organic sulfide. The product is designed for use in industrial applications to precipitate low concentrations of heavy metals in situations where conventional treatment is inadequate.

Product Features

  • Highly effective in industrial applications where metals are heavily complexed or chelated
  • Typically fed in conjunction with one of the AC series coagulants and AP series flocculants in order to increase sludge density and sedimentation.

Link to ACS AN 200 Metal Precipitant


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ACS AP 720 Anionic Flocculant

AP 720 is a water based high molecular weight anionic flocculant (polymer) designed for use in a variety of industrial and municipal wastewater treatment applications. AP 720 is especially effective as a coagulant aid. The product increases floc size and density improving sedimentation and sludge dewatering characteristics.

Product Features

  • AP 720 feed rates range from 100 to 1,000 ppm.
  • AP 720 can be fed directly from the shipping container into an area with good mixing.

Link to ASC AP 720 Anionic Flocculant


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ACS AP 720D Anionic Flocculant

AP 720D is a medium molecular weight anionic dry polyacrylamide based polymer used in a variety of industrial and municipal wastewater treatment applications.

Product Features

  • Increases floc size density improving sedimentation and sludge dewatering characteristics
  • Corrosion toward most standard materials of construction is very low.

Link to ACS AP 720D Anionic Flocculant


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Dow Photoposit SN 68H Photoresist

Link to Dow Photoposit SN 68H PhotoPhotoposit SN 68H Photoresist, developed to address industry demands for a robust, high-yielding, fine-line, low-cost photoresist that can be utilized in today’s manual and automatic exposure equipment at optimum productivity levels. Photoposit SN 68H Photoresist has been optimized for use on double-sided roller coaters and is supplied at a viscosity appropriate for roller coating.

The dried resist film is stackable, has a fast photospeed and has the desired flexibility and durability to allow for easy handling. Photoposit SN 68H Photoresist is most sensitive in the 365 nm region. The resist is developed in convectional conveyorized spray equipment using REsolve Developer 9033. It is compatible with conventional acid etchants and is easily stripped with SURFACEstrip 448 Resist Stripper.

Product Features

  • Unmatched resistance to mechanical and handling damage
  • Fast photospeed-exposure time as low as 2 seconds
  • 28 hours of stackability
  • Excellent chemical resistance to acid-based etchants
  • Excellent coating rheology
  • Improved yield
  • Resolution capability 25 micron lines and spaces
  • Significant savings over dry film
  • Reduced labor and waste costs
  • No tack at exposure
  • Extremely wide processing window
  • Very high resolution capability
  • Low foaming. Little, or no need for the addition of antifoam

Link to Dow Photoposit SN 68H Photoresist


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Dow Tinposit LF Immersion Tin

Tinposit LF Immersion Tin is an immersion tin formulation producing uniform and solderable tin deposits on properly prepared PWB substrates. Tinposit LF Immersion Tin is specifically formulated to be used in lead-free assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit LF Immersion Tin bath is easy to control and has a high tolerance for contaminants.

Link to Dow Tinposit LF Immersion Tin


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Dow Preposit Etch 748

For use in the Circuposit 3000 Process.

Preposit Etch 748 is a mildly-acidic micro-etch that promotes excellent copper innerlayer adhesion. Unlike other persulfate-based micro-etch systems, baths prepared from Preposit Etch 748 are stable and active for considerably longer periods of time with consistent etch rates.

Product Features

  • Uniform micro-etch characteristics assure maximum innerlayer adhesion
  • Produces a matte pink finish with high surface area to enhance bond
  • Improved bath stability-active bath life measured in weeks, rather than days
  • Consistent and controlled etch rates
  • No ammonium ions means simple waste treatment
  • Replenishable through A.O.C. (Active Oxygen Content) analysis
  • Room temperature operation
  • No surface scum as with ammonium persulfate etchants
  • Solution life up to 4 times ammonium persulfate etchants

Link to Dow Preposit Etch 748


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Dow Accelerator PM-964

Accelerator PM-964 was developed for straight-thru ABS plastics. It is an effective accelerator that removes catalyst from plating racks and stop-off paint while leaving the plastic fully catalyzed for consistent and complete electroless coverage. Accelerator PM-964 is referenced in PM Plating on Plastics Process.

Product Features

  • Eliminates stop-off paint and rack plating
  • Permits electroless copper straight-thru plating without process adjustment
  • Reduces production interruption through long bath life, also, has high tolerances to chrome, iron and increases production yields through high consistency in performance.

Link to Dow Accelerator PM-964


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Dow Copper Gleam RG 11

Copper Gleam RG 11 Acid Copper Plating Process is designed for rack, barrel, and reel-to-reel applications. The deposits obtained are very bright, uniform and ductile, and the hardness can readily be controlled to the desired value. Because of exceptional brightener stability, the RG 11 proess is distinguished by ease and economy of operation.

Product Features

  • Ease of operation
  • Bright, ductile deposit
  • Single Additive System

Link to Dow Copper Gleam RG 11


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Dow Ronaclean E950 LF

Ronaclean E950 is an economical, low-foaming, high-detergent alkaline cleaner especially designed for high-speed applications. The best results are obtained when the Ronaclean E950 LF is operated anodically, however it can be operated cathodically or by simple immersion.

Product Features

  • Low foaming
  • High detergency
  • Excellent primary cleaning of most metals
  • Compatible with hard water
  • Maintains detergency for long periods of time
  • Non-chelated, allowing simple waste treatment

Link to Dow Ronaclean E950 LF


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Dow Neutra Rinse 40

Neutra Rinse 40 is an effective post-rinse for parts plated in acid tin and tin-lead processes, e.g. Tin Gleam and the Rohm and Haas Electronic Materials Solderon series.

Neutra Rinse 40 will neutralize any acidic films left on components and will improve the solderability of the deposits.

Product Features

  • Neutralizes acidic film left on tin and tin-lead plated components
  • Improves solderability of components
  • Minimizes staining of plated components during handling

Link to Dow Neutra Rinse 40 Post-Rinse


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Dow Neutra Rinse 80

Neutra Rinse 80 process will neutralize acidic films remaining on tin and tin-lead plated parts. The removal of these films assists in post rinsing operations and is beneficial to the shelf-life of components by minimizing staining during storage and handling.

Product Features

  • Neutralizes acidic film left on tin and tin-lead plated components
  • Improves solderability of components
  • Minimizes staining of plated components during handling

Link to Dow Neutra Rinse 80


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Dow Neutra-Clean 68

Neutra-Clean 68 Soak Cleaner is a neutral pH soak cleaner used to clean nonferrous metal surfaces prior to plating operations and photoresist applications. Neutra-Clean 68 Soak Cleaner is extremely effective in removing organic soils, including hard-to-remove silicone-based hand lotion creams and buffing compounds. Neutra-Clean 68 Soak Cleaner is particularly suited to the following special applications.

Metal Finishing

The neutral pH prevents attack of aluminum, magnesium, or zinc.

Immersion Tin Plating

Neutra-Clean 68 Soak Cleaner eliminates the need to dry copper surfaces prior to Tinposit LT-26 and LT-27 immersion tin plating.

Chemical Machining

Neutra-Clean 68 Soak Cleaning is an efficient cleaner at room temperature, making it easier to prepare metal plates prior to coating with Photoposit Positive Photoresists.

Product Features

  • Effective removal of organic soils
  • Flexibility of operation
  • High yield
  • Ease of operation

Link to Dow Neutra-Clean 68

 


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Dow Neutra Rinse 80

Neutralizer PM-956 is an acidic solution which is used as the second step in the Addiposit IV pretreatment process for plateable grades of liquid crystal polymers. When used after the rinse following Conditioner PM-925, this solution removes any residues remaining on the substrate and prepares the surface for further treatment.

Product Features

  • Excellent removal of conditioner residues
  • Simplicity of make-up and replenishment
  • Low cost
  • Consistent, predictable performance
  • Reduced skip plating

Link Dow Neutralizer-PM 956


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Dow Neutralizer PM-952

Neutralizer PM-952 may be used with the Crownplate Process or PM System for plating-on-plastics and specifically for plating Noryl straight thru. When used after the rinses following chromic acid etch, Neutralizer PM-952 removes residual hexavalent chromium and prepares the etched plastic surfaces for catalyzation. The slightly alkaline neutralizer must be thoroughly rinsed from the parts prior to catalyst treatment.

Product Features

  • Complete catalysis of difficult to plate plastics
  • Allows use of dilute catalyst baths
  • Control of rack plating

Link to Dow Neutralizer PM-952


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Dow Nickel Gleam BR 220

Nickel Gleam BR 220 is a bright nickel plating process. It was developed to meet the high performance requirements demanded by the bright nickel plater and may be used as the to layer of a duplex nickel system where maximum corrosion protection of the substrate is required.

Product Features

  • Deposit has exceptional brightness and leveling over a wide current density range
  • Deposit has excellent ductility and chromium acceptance
  • Nickel Gleam BR 220 can be plated over many suitably prepared surfaces, but it is not recommended for the plating of zinc die castings where the parts fall or blind areas of the casting may contaminate the solution with zinc
  • May be used with air agitation or mechanical agitation when used with the appropriate anti-pitting agent
  • The optional use of the Nickel Gleam BR 220 Replenisher greatly simplifies the operation of the process

Link to Dow Nickel Gleam BR 220


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Dow Niculoy 22-1

Niculoy 22-1 deposits an alloy of nickel, copper, and phosphorus onto metallic and nonconductive substrates.

The alloy has a unique combination of properties-Brightness, deposits are extremely bright, smooth and reflective with an appearance approaching that of bright nickel electroplate. Corrosion resistance is extremely high, e.g. a one mil coating thickness on mild steel will withstand 240 hours salt spray testing without breakdown. Ductility, flexural capacity exceeds that of any other known electroless nickel deposit. Hardness as plated is 600 Vickers and heat treatment at 399°¼C (750°¼F) maximizes hardness at more than 1,000 Vickers. Wear resistance and acid resistance are also very high while the deposit is virtually non-magnetic.

Because of its versatility, the Niculoy 22-1 alloy as found special applications in areas of high technology such as computer memory discs, high technology such as computer memory discs, high accuracy metal optics and molding tools.

Product Features

  • Simple operate-for make-up mix 2 concentrates with water and heat to operating temperature; no pH adjustments or other time-consuming factors are required; replenishers are added directly to the working bath at operating temperature
  • Ease-of control-replenishment is based on nickel content and replenishers maintain bath concentration and pH
  • Fast and consistent plating rate-approximately 0.5 mils consistently deposited per hour at 88-93°¼C (190-200°¼F) when operated according to instructions

Link to Dow Niculoy 22-1


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Dow Nikal MP-200 (SE)

Rohm and Haas Electronic Materials Nikal MP-200 (SE) offers numerous advantages of precision high-speed nickel plating in the electronic, printed circuit and allied fields where low or controlled stress, ductility and good color are desired. The bath has been particularly designed for operation in automated tab plating equipment. Available either in Sulfate Nickel or Sulfamate Nickel versions, the process is characterized by simplicity of operation and high tolderance to metallic impurities. Excellent as an underplate for gold, rhodium and solder.

Product Features

  • Bright ductile deposits with low porosity and slight tendency to leveling.
  • Color uniform over with range of current densities.
  • Approximate hardness of 500 VPN, increasing with higher additive concentration.

Link to Nikal MP-200 (SE)


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Dow Niposit 428 Nickel Stripper

Niposit 428 Nickel Stripper is a stable, non-cyanide product designed to remove electroless and most electroplated nickel deposits from ferrous and copper alloys, without substrate attack.

Product Features

  • High yield up to 3 mil feet per gallon or 14 gm of nickel metal per liter of bath
  • High stability even when kept at operating temperature for extended periods of time
  • Lower temperature operation; can be operated at 170-175°¼F (77-79°C)
  • Bath does not contain cyanide
  • No substrate attack

Link to Dow Niposit 428 Nickel Stripper

 


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Dow Palladure 200

The Palladure 200 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for electronic applications from a mildly alkaline, ammoniacal electrolyte.

Typical applications include electronic connectors, printed circuit edge tabs and semiconductor components. For connector applications, the benefits of palladium coatings can be enhanced by using a palladium nickel underplate. The palladium-nickel/palladium composite exhibits superior corrosion resistance and ductility. The palladium/gold flash compositee exhibits excellent wear resistance and is a suitable replacement for hard gold.

For semiconductor components, thin palladium coatings are suitable as a bondable surface, replacing silver on the inner leads and pads of devices, and as a solderable coating on the external leads replacing tin-lead.

Product Features

  • Low porosity electrodeposits offer excellent protection against base metal/undercoat oxidation and corrosion
  • Excellent wire bonding characteristics in semiconductor applications
  • Thin coatings function well as a solderable finish
  • Low, stable contact resistance and very good wear resistance in connector applications when used in conjunction with a thin gold flash top coat

Link to Dow Palladure 200


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Dow Palladure 500

The Palladure 500 process is characterized by its ability to produce semi-bright to bright, crack-free, pure palladium deposits suitable for electronic applications.

Product Features

  • Exceptional contact stability
  • Solution is capable of producing very high plating rates
  • Low internal stress of deposit

Link to Dow Palladure 500


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Dow Pallamet 500 Palladium-Nickel

The Pallamet 500 Palladium-Nickel Electrolyte produces bright, ductile palladium-nickel deposits of approximately 80% Pd/20% Ni from a sulfate-based (chloride-free) system. The nearly neutral pH of the plating solution can be run at higher temperatures and lower palladium concentrations, improving the properties of the deposit and stable bath operation.

The palladium-nickel deposits produced from the Pallamet 500 Palladium-Nickel electrolyte demonstrate low internal stress and exhibit low porosity. Pallamet 500 Palladium-Nickel plating solution can be utilized for reel-to-reel applications with different cell designs (i.e. control depth, spot tool).

Product Features

  • Near neutral pH, sulfate bath eliminates costly equipment/anode requirements
  • Stable alloy composition over wide range of current density and plating conditions
  • Simple analytical procedures for all bath components
  • Excellent ductility and low internal stress
  • Excellent wear resistance
  • Low, stable contact resistance when used with a thin gold flash topcoat

Link to Dow Pallamet 500 Palladium-Nickel

 


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Dow Ronaclean E950

Ronaclean E950 is an economical, heavy-duty, high-detergent alkaline cleaner especially designed for wire applications. The best results are obtained when the Ronaclean E950 is operated anodically. However, it can be operated cathodically or by simple immersion.

Product Features

  • Excellent smut removal
  • High-temperature capacity up to 95°¼C (200°¼F)
  • Dustless, free-flowing and free-rinsing
  • Compatible with hard water
  • Maintains detergency for long periods of time
  • Low-foaming and non-chelated allowing for simple waste treatment

Link to Dow Ronaclean E950


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Dow Tinposit LT-26 Immersion Tin

Tin is deposited onto copper, copper-based alloys and tin/lead electroplate by simple immersion in the Tinposit LT-26 Immersion Tin plating bath. The deposits bond chemically to the base metal, and affords corrosion protection. There are a number of choice of bath make-ups and operation processes to meet various requirement.

Product Features

  • Exceptional corrosion protection to copper and tin-lead electroplate, and greatly facilitates soldering.
  • Excellent for barrel plating and for tinning complex shaped parts.

Link to Dow Tinposit LT-26 Immersion Tin


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Dow Ronapol 200

Ronapol 200 is an anodic polish for copper and copper alloys, for example phosphor-bronze and beryllium-copper, giving smooth, brilliant surface finishes. Ronapol 200 is designed to be used in reel-to-reel equipment as part of the pretreatment prior to plating. The process will operate over a wide range of current densities and does not crystallize on cooling. Ronapol 200 is formulated to have a long life, being semi-sludging; most of the metallic salts produced during electropolishing settle to the bottom of the tank. Performance in normal rack applications, for example metal burr removal, is excellent. Where parts are subsequently to be electroplated, de-passivation in 10-15% hydrochloric acid or a cathodic activator is necessary.

Product Features

  • Operation over a wide current density range
  • Long life solution
  • Excellent metal burr removal

Link to Dow Ronapol 200


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Dow Ronastan TP-SR

The Ronastan TP-SR electroplating process is specifically formulated for use in high-speed continuous steel strip tin plating operations.

Product Features

  • Based on a biodegradable acid; effluent treatment can be readily achieved with standard neutralization and filtration procedures
  • Extremely wide temperature range 21-65°C (70-149°F) allowing bath operation at high current densities
  • Wide current density range permitting economical bath operation at reduced tin concentrations
  • Supplied as liquid concentrates, which facilitate the use of automatic replenishment systems
  • StannGuard Antioxidant ensures resistance to the formation of insoluble decomposition products

Link to Dow Ronastan TP-SR


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Dow Silver Strip LR-525

Silver Strip LR-525 is an alkaline non-cyanide electrolytic stripping process designed for removal of silver flash from copper and copper alloy base materials. Silver Strip LR-525 is particularly suitable for reel-to-reel or cut strip spot plating equipment.

Product Features

  • Extended bath life compared to conventional back-stripping processes
  • Non-cyanide based electrolyte
  • Effectively removes silver flash without discoloring the silver or copper surfaces
  • Suitable for use in high speed reel-to-reel and cut strip applications.

Link to Dow Silver Strip LR-525


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Dow Solderon BI MH-400

Solderon Bi MH-400 is a lead-free, organic sulfonate electroplating process for the high-speed deposition of uniform, fine grain, matte tin-bismuth alloy coatings.

Solderon Bi MH-400 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications.

Product Features

  • Environmentally-friendly, lead-free coating
  • Excellent solderability
  • Uniform deposit appearance
  • Excellent alloy stability
  • Low co-deposited organics

Link to Dow Solderon BI MH-400


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Dow Ronaclean E950

Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonite electrolyte. Fully-solderable deposits can be plated with alloy compositions ranging from 60% through 95% tin. The process offers enhanced throwing power and low current density brightness.

Product Features

  • Non-fluoborate electrolyte
  • Excellent brightness
  • Fully-solderable deposits
  • Stable alloy and thickness distribution over the working current density range

Link to Dow Solderon BLS


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Dow Solderon BTD

Solderon BTD is a low-foaming electroplating process for the high speed deposition of bright tin and tin-lead alloys from a non-fluoborate electrolyte.

The Solderon BTD system is designed for use in the high-speed reel-to-reel selective electroplating of connector components with tin and high tin-lead alloy (>80% tin) coatings.

Product Features

  • Very low-foaming electrolyte.
  • High cathode efficiency, which minimizes the problem of poor definition caused by stable cathodic foam in controlled depth cell electrodeposition
  • Exceptional solderability and performance.

Link to Dow Solderon BTD


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Dow Solderon ST-200

Solderon ST-200 is a low-foaming, organic sulfonate electroplating process for the high-and low-speed deposition of uniform, large, well-polygonized grain tin deposits.

Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low-speed plating applications.

Product Features

  • Environmentally-friendly, lead-free coating
  • Low stress
  • Large grain size keep well polygonized
  • Excellent solderability
  • Low-foaming electrolyte
  • Uniform, satin-matte deposit appearance

Link to Dow Solderon ST-200


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Dow Solderon ST-380

Solderon ST-380 is a high-speed, sulphonate-based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines over a wide current density range. Due to its specific designed chemistry, the Solderon ST-380 electrolyte provides a deposit with low whisker propensity and excellent solderability performance, especially at 215°C (419°F) after 8 hours steam age. Simple neutralization of drag-out rinse water will produce a non-hazardous effluent.

Product Features

  • High deposition rates that lead to high throughput values
  • Excellent solderability performance
  • Low-carbon content in the deposit
  • Consistent and stable surface morphology
  • Low foaming electrolyte
  • Ease of use

Link to Dow Solderon ST-380


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Dow Super Strip 300

The Super Strip 300 process will strip gold and gold alloys from all basis metal at unusually high speeds. There is little attack on base metals, such as iron, nickel, copper and their alloys, and the solution has the further advantage of room temperature operation. Up to 60 g/1 (8 oz./gal.) of gold can be dissolved in the stripping solution, after which it is refined to salvage the gold.

Product Features

  • Room temperature operation
  • Rapid stripping rate
  • Economical use
  • Ease of operation

Link to Dow Super Strip 300


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Dow Actronal 660

Actronal 660 is an acidic descaler designed to remove the oxides and heat scale from copper-based alloys.

Product Features

  • Short immersion time
  • Contains no halide ions
  • Completely non-foaming solution
  • Low acidity

Link to Dow Actronal 660


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Dow Aurall 364-A Strike Bath

Aurall 364-A Strike Bath is designed to plate thin, adherent, pure gold electrodeposits onto copper, nickel and nickel alloys.

Product Features

  • Compatible with plating processes using Aurall 305 and 305 M Electrolytic Gold
  • Provides initial layer of adherent gold on nickel, copper and iron based substrates or underplates

Link to Dow Aurall 364-A Strike Bath


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Dow Aurovel UP 24

Aurovel UP 24 electrolytic gold is a multipurpose 24-karat gold electroplating product that can be adapted for use in rack, barrel and strip line operations. Deposits are semi-bright to bright, ultrapure, ductile and meet the requirements of Mil Spec G45204C, Type III, Grade A and ASTM B 488, Type III, Code A.

Product Features

  • Wide operating current density range
  • Stable deposit color over a wide range of operating conditions
  • Low gold concentration
  • Ease of cooperation and control

Link to Dow Aurovel UP 24


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Dow Cataposit PM-959 Catalyst

Cataposit PM-959 Catalyst has been specifically formulated for plating on plastics. Cataposit PM-959 Catalyst has been proven to work successfully on ABS, Noryl, and ABS/Polycarbonate blends in the existing Rohm and Haas Electronics Materials CROWNPLATE and PM Systems. High yields and total compatibility with established Rohm and Haas Electronic Materials plating on plastic systems result in high economy of operation.

Product Features

  • Zero bath growth- stable to 57°C (185°F)
  • Economical Operation
  • High chromium tolerance-high tin to palladium ratio
  • High production yield-complete part coverage with maximum control of rack and stop-off plating

Link to Dow Cataposit PM-959 Catalyst


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Dow Aurolectroless SMT 520 Immersion Gold

Aurolectroless SMT 520 Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The Aurolectroless SMT 520 Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

Product Features

  • Lower gold content substantially reduces operating costs
  • Flexible and easy gold thickness control
  • Excellent solderability

Link to Dow Aurolectroless SMT 520 Immersion Gold

 


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Solderon BP TS 4000 Matte Tin/Silver

Solderon BP TS 4000 Matte Tin/Silver bump plating bath is a low-foaming, organic sulfonate-based electrolyte for the high-speed deposition of uniform, fine-grain, matte tin/silver alloy coatings.

Solderon BP TS 4000 Matte Tin/Silver bath is specifically designed for use in a semiconductor wafer plating process, producing fine-grained, smooth, solderable reflowed solder bumps with consistent alloy compositions.

Product Features

  • Environmentally-friendly, lead-free coating
  • Completely void-free reflow performance
  • Uniform deposit thickness and composition
  • Uniform deposit appearance
  • Low-foaming and stable electrolyte
  • Excellent reflowed bump morphology
  • Compatible with both horizontal and vertical plating equipment
  • Suitable for both in-via and mushroom deposition
  • High deposition rates
  • Ease-of-process control

Link to Dow Solderon BP TS 4000 Matte Tin/Silver


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Dow Solderon MHS-W

Solderon MHS-W is a high-speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in reel-to-reel wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems.

The components of the Solderon MHS-W are stable and soluble in the electrolyte at elevated temperatures, which allows for operation at higher cathodic current densities of operation. Uniform pure tin and tin-lead alloy deposits, which exhibit excellent solderability and fusing characteristics, are obtainable over a wide current density range.

Product Features

  • Based on biodegradable acid, effluent treatment can be readily achieved with standard neutralization and filtration procedures
  • Non-foaming electrolyte
  • Non-fluoborate
  • High achievable deposition rates
  • Excellent thickness distribution and alloy stability over a wide current density range.

Link to Dow Solderon MHS-W


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Dow KADIZID

The Kadizid process produces bright cadmium electrodeposits directly from an acid bath. The brightness of the deposit is comparable to that obtained from the most widely used cyanide cadmium baths.

Product Features

  • The solution can be used for barrel and rack plating and is easy to operate and control.
  • Throwing power is good and plating speed is comparable to cyanide baths.

Link to Dow Kadizid


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Dow Solder Strip 8T

Solder Strip 8T is designed to strip both tin and tin-lead alloys rapidly from copper and its alloys.

Link to Dow Solder Strip 8T


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Dow Solderon BHT-350 Bright Tin

Solderon BHT-350 Bright Tin is a high speed, sulphonate-based tin electroplating product formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BHT-350 Bright Tin electrolyte is free of volatile aldehydes and may be operated at temperatures up to 50å¡C.

The Solderon BHT-350 Bright Tin electrolyte provides bright deposits over a wide current density range. Its propriety formulation controls both grain size and carbon content in deposits which results in a very ductile bright deposit. Solderon BHT-350 Bright Tin products do not contain methanol ensuring a more environmentally friendly electrolyte compared to other conventional bright tin processes. Analytical procedures are available for all bath components.

Product Features

  • High operating temperature enabling high plating rates and reducing volume increases
  • Excellent brightness and solderability over a broad current density range
  • Low carbon content in the deposit
  • High ductility of the deposit
  • Low foaming electrolyte
  • Consistent and stable surface morphology

Link to Dow Solderon BHT-350 Bright Tin


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Dow Niposit PM-988

Niposit PM-988 is a low-temperature electroless nickel process specifically designed for a variety of “plating on plastics” applications. The Niposit PM-988 process is ammonia-, lead- and cadmium-free.

Product Features

  • Low-temperature operation
  • Ammonia free formulation
  • Lead- and cadmium-free formulation
  • Outstanding bath stability

Link to Dow Niposit PM-988


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Dow Tinglo Culmo Bright Acid Tin Electroplating

The Tinglo Culmo Process offers extremely bright tin deposits with excellent solderability and ductility, capable of meeting the requirements for electronic, industrial and decorative applications. The process is distinguished by its stability, economy, easy of operation and exceptional throwing power.

Product Features

  • Bright, leveled deposit
  • Good solderability after long periods of storage
  • Relatively non-porous deposit
  • Meets Mil T-10727A for corrosion protection (salt spray)
  • Economy and ease of use

Link to Dow Tinglo Culmo Bright Acid Tin Electroplating


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Dow Silver Glo 3KBP

The Rohm and Haas Electronic Materials Silver Glo 3KBP process is designed to produce bright silver deposits over a wide range of current densities (0-7 amps/ft), with high cathode efficiency and simplicity of process control. The 3KBP is suitable for all decorative applications and rack and barrel operations. Silver deposits from the 3KBP have superior tarnish resistance compared to other silver plating processes.

Product Features

  • The 3KBP solution can be used in decorative applications, rack and barrel
  • Ease of Control
  • Clear, water-white solution for easy viewing of work during plating

Link to Dow Silver GLO 3KBP


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Dow Solderon BT-280

Solderon BT-280 is a high-speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BT-280 electrolyte gives bright deposit over a wide range of current density. Its proprietary formulation controls both grain size and grain orientation which results in a stable deposit. The additive system also plates bright Sn finish with minimum organic inclusions. Simple analytical procedures are available for all products in the process.

Product Features

  • High deposition rates leading to high throughput values
  • Produce excellent brightness and solderability
  • Low carbon content in the deposit
  • Low foaming electrolyte
  • Consistent and stable surface morphology
  • White foam line, which allows partial plating or control depth plating

 


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Dow Solderon BT-150

Solderon BT-150 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines and provides fully bright pure tin deposits over a wire range of current density and bath temperature.

Product Features

  • High-Speed, Low-Foaming Bright Tin Process
  • The low foaming Solderon BT-150 electrolyte is free of volatile aldehydes
  • May be operated at temperature up to 45å¡C and tin concentrations up to at least 100 g/l without loss of deposit brightness
  • åÊConvenient methods of analysis are available for the proprietary components.

Link to DowåÊSolderon BT-150


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Dow No Tarn PM-3 Silver Antitarnish

No Tarn PM-3 Silver Antitarnish bath was specifically developed for protection of silver from sulphidation. It is based on aqueous, metal-free solution in which the organic inhibitor is present as a fine dispersion. The passivation layer is applied by immersion and is specifically designed for silver surfaces.

Product Features

  • Protects silver deposits from tarnishing
  • No adverse effect on contact resistance, solderability or bondability
  • No influence on colour brightness of underlying deposit
  • Effective protection of tarnishing for copper, palladium and thin gold layers
  • Free from metal ions an halogenated hydrocarbons

Link to No Tarn PM-3 Silver Antitarnish


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Dow Neutralizer PM-954

Neutralizer PM-954 is used in the Crownplate Process and PM System for plating-on-plastics. When used after the rinses following chromic acid etch, Neutralizer PM-954 reduces residual hexavalent chromium and prepares the etched plastic surfaces for catalysis.

Product Features

  • Excellent removal of chrome residues from plastics
  • Simplicity of make-up and replenishment
  • Low cost
  • Consistent, predictable performance

Link to Dow Neutralizer PM-954

 


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Dow Niposit Nickel Stripper 424

Niposit Nickel Stripper 424 rapidly strips electroless nickel-phosphorus deposits from mild steel and steel alloys without substrate attack.

Product Features

  • Rapid Stripping-1.0 to 1.5 mils of Niposit electroless nickel is stripped per hour when bath is freshly made up
  • High Yield-Niposit Nickel Stripper 424 strips approximately 3 mil fit of nickel deposit per gallon of made-up bath before stripping rate becomes too slow
  • High Stability-the bath is extremely stable, even when kept at operating temperature for extended periods of time
  • Non-cyanide-the bath does not contain cyanide
  • No Pitting of Steel-Niposit Nickel Stripper 424 does not pit steel substrates

Link to Dow Niposit Nickel Stripper 424


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Dow Nickel Gleam EP

Nickel Gleam EP is a single-additive process designed to produce nickel-phosphorus alloy deposits over a wide range of current densities. The composition of the deposit produced is dependent on additive content and current density. The major use of the process is for high-speed application of diffusion-barrier deposits for gold or silver undercoats on ferrous alloy substrates. The alloy at 11% phosphorus produces a low melting point eutectic at 880°¼C. This alloy can be used for hydrogen-furnace brazing of Nimonics and stainless steels etc. The alloy at 5% phosphorus produces a deposit with low co-efficient of friction, which is desirable in connector applications.

Product Features

  • Single-additive process

Link to Dow Nickel Gleam EP


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Dow Conductron DP Accelerator LC

Conductron DP Accelerator LC is designed to promote initially rapid and complete coverage at the subsequent electrolytic copper plating stage, thus ensuring a void-free and fully adherent through-hole copper deposit.

Link to Conductron DP Accelerator LC


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Dow CUPURE Cyanide Free Alkaline Copper Plating

CUPURE Cyanide Free Alkaline Copper is a plating product that is easy to maintain and offers semi-bright ductile deposits with good throwing power. It is an excellent choice on steel as a stop-off for carburizing or nitriding and as a pre-plate for nickel, acid copper or other finishes.

Product Features

  • The Cupure Cyanide Free Alkaline Copper Plating product can be used directly onto most steel substrates.

Link to CUPURE Cyanide Free Alkaline Copper Plating


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Dow Ronapol 200

Ronapol 200 is an anodic polish for copper and copper alloys, for example phosphor-bronze and beryllium-copper, giving smooth, brilliant surface finishes. Ronapol 200 is designed to be used in reel-to-reel equipment as part of the pretreatment prior to plating. The process will operate over a wide range of current densities and does not crystallize on cooling. Ronapol 200 is formulated to have a long life, being semi-sludging; most of the metallic salts produced during electropolishing settle to the bottom of the tank. Performance in normal rack applications, for example metal burr removal, is excellent. Where parts are subsequently to be electroplated, de-passivation in 10-15% hydrochloric acid or a cathodic activator is necessary.

Product Features

  • Operation over a wide current density range
  • Long life solution
  • Excellent metal burr removal

Link to Dow Ronapol 200


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Dow Silveron GT-101 Silver Strike

Silveron GT-101 Silver Strike is an alkaline non-cyanide pure silver strike plate designed for use prior to the Silveron GT-101 Electrolytic Silver to achieve good adhesion of silver to nickel or nickel alloy substrates.

Product Features

  • Cyanide-Free

Link to Silveron GT-101 Silver Strike


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Intervia 2011 Remover

Intervia 2011 Remover is a mixture of pure organic solvents specifically formulated to remove all Microposit, Megaposit, and Intervia Photoresists. It is particularly recommended for use in applications where the photoresist has seen high temperatures, strong etchants, or other harsh processing conditions.

Product Features

  • Extended Bath Life
  • Substrate Compatibility
  • Ease of Operation
  • Environmental and Health Advantages

Link to Dow Intervia 2011 Remover


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Dow Solderon SC

Solderon SC is a low-foaming, organic sulfonate electroplating for the high-speed deposition of uniform, fine-grain, matte tin an tin/lead alloy coatings.

Solderon SC is specially designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications.

Product Features

  • Very low-foaming electrolyte
  • Extremely stable alloy and thickness distribution across the operating current density range
  • Outstanding performance at high current densities
  • Uniform deposit appearance

Link to Dow Solderon SC


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Dow Silveron GT-101 Bright Silver

Silveron GT-101 Bright Silver is an alkaline non-cyanide pure silver electroplating electrolyte designed to produce bright silver deposits for various applications. The product can be used in conventional plating equipment and high speed reel-to-reel, jet or wire plating equipment. The silver deposits can be applied to both copper alloy and nickel alloy substrates.

Product Features

  • Bright white pure silver deposit (>99.9% Ag)
  • Free of metallic grain refiners
  • Stable plating solution and constant bath performance
  • Micro-hardness of the deposit: 100-120 HV (no softening effect at 150°C/1h)

Link to Dow Silveron GT-101 Bright Silver


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Dow Silver Glo 3K

The Rohm and Haas Electronic Materials bright silver process 3K is a simplified process designed to produce bright silver deposits at high current densities 0-7.0 amps/dmå_ hull cell, high efficiency, and with simplicity of control. The 3K solution can be adopted for industrial and electronic applications and rack and barrel operations without radical formula changes. Silver deposits from the 3K bath have tarnish resistance superior to that secured from conventional silver. Since the 3K solution is clear, it enables the operator to view the work while plating and to readily view and recover parts that may have fallen to the bottom of the tank.

Product Features

  • The 3K solution can be used in industrial and electronic applications, rack, barrel, and reel-to-reel operations
  • Concentrated replenishment

Link to Dow Silver Glo 3K


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Dow Copper Gleam RG 11

Copper Gleam RG 11 Acid Copper Plating Process is designed for rack, barrel, and reel-to-reel applications. The deposits obtained are very bright, uniform and ductile, and the hardness can readily be controlled to the desired value. Because of exceptional brightener stability, the RG-11 process is distinguished by easy and economy of operation.

Product Features

  • Ease of operation
  • Bright, ductile deposit
  • Single Additive System

Dow Copper Gleam RG 11 TDS


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Surtec 533

SurTec 533 is an Aqueous Corrosion Inhibitor.

Product Features

  • Liquid
  • Temporary corrosion protection
  • For spray- and soak application
  • Suitable for iron and steel
  • Free of nitrites
  • Suited for vibratory finishing

Link to Surtec 533

 


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SurTec 668

SurTec 668 is a chromium(VI)-free blue passivation for zinc that is suitable for all zinc processes. åÊIt has good corrosion protection with excellent color and brilliance.

Product Features

  • Liquid concentrate with slight precipitate
  • Trivalent blue passivation without hexavalent chromium or oxidizing agents
  • Contains cobalt, to improve the corrosion resistance
  • Produces passivation layers with intensive blue color, even at shorter application times
  • Long service-life
  • Can easily be analyzed and replenished

Link to Surtec 668

 


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SurTec 555 S

Surtec 555 S can be applied in immersion and spray process. It is applicable for all kinds of passivation and gives superior appearance. Surtec 555 S is suitable for trivalent blue passivation, chromiting and trivalent black passivation, as well as for hexavalent yellow and olive chromates.

 

 

Product Features

  • Liquid dispersion of organic polymers and nanoparticles of silicon dioxide
  • Free of chromates
  • Produces a clear film
  • Heat resistant corrosion protection up to 24 hours at 120 Degrees Celcius.
  • Improves the corrosion protection by 100-200 h neutral salt spray, with respect to the used passivation treatment
  • Can be removed with the help of hot alkaline SurTec cleaners
  • Volvo-standard (soluble hexavalent chromium) is guaranteed, also by use of hexavalent chromatings
  • The usage of SurTec 550 A Sealer Additive for adjusting the pH-value suppresses a darkening of the last draining drop, increases the corrosion resistance and improves the uniform layer formation.

Link to Surtec 555 S

 

 

 


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Surtec 650 chromitAL TCP

SurTec 650 chromitAL® is a chromium(VI)-free trivalent passivation for aluminium. The liquid concentrate delivers an excellent corrosion protection, comparable with the corrosion protection of a hexavalent passivation.

SurTec 650 chromitAL® is suitable for alloyed and casted aluminium and pretreatment before laquering, powder coating and gluing. It is easy to handle in immersion, spray and wipe application and produces an iridescent, faintly blue to tan and visible layer.

SurTec 650 chromitAL® meets or exceeds MIL-DTL-81706 and MIL 5541 for bare corrosion (336 h in NSS per ASTM B-117, respectively, DIN 50021 SS) and has a low contact resistance (< 0.8 mOhm/cm2). It is also heat resistant up to 100 °C (212 °F) with minimal loss in corrosion resistance.

Product Features

  • Hexavalent chromium-free passivation for aluminum
  • Suitable as post-treatment of anodic coatings
  • Suitable as conversion coating of magnesium
  • Liquid concentrate, based on trivalent chromium
  • Excellent bare corrosion protection comparable to hexavalent passivations
  • Also works on alloyed and casted aluminum
  • Easy to  handle in immersion, spray and wipe application
  • Produces an iridescent, faintly blue to tan and visible layer
  • Suitable as pre-treatment before lacquering, powder coating and gluing and approved by GSB and QUALICOAT

Link to SurTec 650 chromitAL®

 

 


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Hubbard Hall Black-Magic RT S 30

Room temperature blackening solution for powdered metal and steel with minimal smut generation. Black-Magic RT S 30 is very effective on porous powdered or sintered metal and good on carbon steel. It is very effective on stampings, machine/ground steel, spring steel, hardened and polished steel, and high silicon alloys.

Product Features

  • Smut: low to none formed >
  • Works well with Activation by Black Magic Predip P
  • Liquid concentrate use one part to 9 parts water
  • Maintains black over time with high Silicon alloys
  • 70 to 90 F Temperature range(21 – 32 C)
  • RoHS and REACH Compliant

Link to Hubbard Hall Black-Magic™ RT S 30

 


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Hubbard Hall Black Magic Infusion

A hot black oxide process for steel, Black Magic™ Infusion converts outer micron of steel to black oxide passive phase for corrosion protection acting as a micro layer to hold corrosion inhibitors and oils.

Black Magic™ Infusion is the new standard against which all other black processes will be compared for performance and quality. This formulation contains a unique blend of activators, rectifiers, catalysts, and penetrants designed to produce the darkest black available. Black Magic™ Infusion’s unique formulation also allows the user to decrease the immersion without a sacrifice in quality. In fact, Black Magic™ Infusion is designed to minimize the common problem of red iron oxide adherence on to the work.

Product Features

  • Easy additions with Liquid Product
  • Economical dark black appearance
  • Temperature 282 to 290 F (139 – 143 C)
  • Military Spec MIL C 13924, Mil C 46110
  • RoHS and REACH Compliant
  • Excellent for paint adhesion
  • No build up on threaded parts
  • Wear-in Break-in function
  • Forms Magnetite Fe3O4
  • No dimensional change

Link to Hubbard Hall Black Magic™ Infusion

 

 


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Hubbard Hall Aquastrip ACB

Aquastrip ACB is a mildly acidic liquid concentrate, which is used to remove tenacious polymeric coatings including epoxy paints from ferrous and non-ferrous metals. We DO NOT suggest the use of this product on zinc containing alloys. This fast, safe, and effective paint stripper does not contain any hazardous solvents. Aquastrip ACB is versatile and can be used at temperatures ranging 100o F – 180o F. However, it should be noted that using Aquastrip ACB at temperatures less than 120o F on metal parts is detrimental to the stripping solution, as well as the parts being stripped. The use of Aquastrip ACB at elevated temperatures will result in reduced strip times, but it will also reduce the solution bath life.

Product Features

  • Removes most coating in sheets
  • Contains non-hazardous solvents
  • No flash point
  • Can be used on most metals
  • Biodegradable
  • Easily filtered for extended bath life
  • Liquid concentrate that can be diluted
  • Can be used to clean and re-use masking materials

Link to Hubbard Hall Aquastrip ACB

 


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Hubbard Hall Aquaease SL 917

Aquaease™ SL 917 is low foam, heavy duty caustic, chelated alkaline soak, ultrasonic, electro, and spray cleaner for steel, stainless steel, nickel, copper, and copper alloys.

Product Features

  • Concentrated liquid
  • Low foam
  • High detergency
  • Biodegradable wetting system
  • Removes light surface oxides
  • Removes light rust on steel and 400 series stainless steel
  • Produces a metallurgical clean surface
  • Excellent particulate soil removal when used as a spray
  • Easily waste treated
  • Effective at low concentrations
  • Effective at low operating temperatures

 

Link to Hubbard Hall Aquaease™ SL 917


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Hubbard Hall Aquaease SL 689

Aquaease SL 689 is a liquid duty alkaline soak for cleaning ferrous metals, copper, magnesium alloys and brass alloys. Aquaease SL 689 may be used in either a rack or barrel plating line or in an agi-dip soak cleaning operation. Aquaease SL 689 will clean a variety of fabrication oils and synthetic lubricants from the above metals.

Product Features

  • a liquid version of Aquaease S 986, in that may be substituted for Aquaease S 986.

Link to Hubbard Hall Aquaease SL 689

 


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Hubbard Hall Aquaease ACLF #3

Aquaease ACLF #3 is an acid cleaner and deoxidizer for aluminum, copper alloys, steel, and stainless steel surfaces. It contains a blend of inorganic acids, surfactants and solvents to remove heavy soils quickly and effectively. It may also be used to descale steel surfaces.

Aquaease ACLF #3 is extremely free rinsing and may be used in soak or spray applications. It is safe when used as directed. All surfactants used in Aquaease ACLF #3 are biodegradable.

Product Features

  • Biodegradable surfactants
  • Combination cleaner / deoxidizer
  • Removes heavy soils
  • Is quick and effective
  • Easy to use liquid
  • Goes along way

Link to Hubbard Hall Aquaease ACLF #3

 


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Hubbard Hall Mi-Phos M-5

Mi-Phos M-5 is a manganese phosphate for steel. Mi-Phos M-5 is formulated to produce a non-metallic, oil adsorptive iron manganese phosphate coating on steel and iron surfaces. The coating is designed to reduce wear on moving surfaces such as pistons, rings, camshafts, tappets and similar bearing surfaces. When used properly, Mi-Phos M-5 meets the requirements for DOD-P-16232. Mi-Phos M-5 prevents “scuffing” and/or “galling” on moving parts, particularly during a break-in period, increases lubrication of treated surfaces, can be used as a corrosion-resistant finish, and levels machine surfaces from scratches from machining.

 

Product Features

  • Easy additions with Liquid Concentrate
  • Temperature 205 to 210 F (96 – 99C)
  • Military Spec : MIL DTL 16232G
  • RoHS and REACH Compliant
  • Excellent for paint adhesion
  • Anti-gall; Break-In

 

Link to Mi-Phos M-5


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Hubbard Hall Mi-Phos Z-4000

Mi-Phos Z-4000 is a heavy immersion zinc phosphate formulated to exceed the requirements of GM 4435M, Ford S-2 and Chrysler PS-18 specifications. The Mi-Phos Z-4000 provides excellent corrosion protection on ferrous metal parts by depositing in excess of 2000 milligrams per square foot of crystalline zinc phosphate. When used with Metal Guard 320 or a Metal Guard 560, Mi-Phos Z-4000 can surpass 168 hours of ASTM B-117 salt spray protection.

 

Product Features

  • Nickel-Free Heavy-Zinc Phosphate for Immersion coatings
  • Concentration of 3-4% by volume
  • Optimum temperature between 160-175 degrees F

Link to Hubbard Hall Mi-Phos Z-4000


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Hubbard Hall Mi-Phos Z-2

Mi-Phos Z-2 is a heavy zinc phosphate for steel. Mi-Phos Z-2 chemical is formulated to produce on steel and iron surfaces a non-metallic, oil absorptive coating of zinc phosphate. This coating is an excellent base for the retention of a rust preventative, which will increase the corrosion resistance of the final finished part.

Product Features

  • Heavy Zinc Phosphate
  • Temperature 190 to 200 F (88 – 93 C)
  • Military Spec MIL DTL 16232
  • Excellent for paint adhesion
  • Dip or Spray

Link to Hubbard Hall Mi-Phos Z-2


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Hubbard Hall Emerald Seal 308

Emerald Seal 308 is an acidic, non-chromated final seal treatment for pretreatment systems prior to painting. The product’s concentrated liquid form allows quick bath make-up and adjustments to minimize maintenance time. This product is designed to produce a corrosion resistant, adhesion promoting metal surface profile, which will enhance the bonding of most organic finishes to the treated parts. Comparative testing has shown that the underfilm corrosion and organic delamination is reduced compared to fresh or D.I. water final rinsing.

Product Features

  • Emerald Seal 308 is a non-chromic acid product
  • Greatly reduces the cost and efforts required for safe disposal in comparison to chromate based materials.
  • Compliments most paints
  • Low to No Foam
  • Effective on all grades and types of metal.

Link to Hubbard Hall Emerald Seal 308


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Hubbard Hall Hubfos 150

Hubfos 150 is a cleaner and iron phosphate for steel, aluminum and zinc. Hubfos 150 is an organic accelerated iron phosphate. It is a water-soluble liquid, which cleans and produces an iridescent iron phosphate coating on steel and other ferrous metals. It may also be used on galvanized surfaces. Hubfos 150 has been formulated to be used in spray washer and immersion applications prior to painting (oil or water based) powder coating, or the application of an organic coating. Hubfos 150 meets federal specification TT-C-490 Type II.

Product Features

  • Easy additions with Liquid Concentrate
  • Temperature 110 to 170°F (37 to 77°C)
  • Mil Spec TT-C-490 Type II.
  • Cleans light soils and phosphates in one step
  • Excellent for paint adhesion
  • Our highest coating weight product for Iron Phosphate

Link to Hubbard Hall Hubfos 150


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Hubbard Hall Emerald Paint Prep 380 NP

The Emerald Paint-Prep 380 NP system is phosphate-free with no regulated heavy metals. It is specially formulated for use in the treatment of steel, zinc and aluminum surfaces for 4 to 7-stage spray washers. It is designed to help reduce energy costs by providing a very effective conversion coating that can be applied at temperatures ranging from 70 to 110 F, resulting in lower energy costs. Since Emerald Paint-Prep 380 NP is phosphate-free, sludge is reduced to the minimum while waste treatment costs and other effluent issues are greatly diminished.

Performance Features

  • Low use cost, extra-long bath life
  • Ease of handling and replenishment
  • Excellent base for paint
  • Excellent corrosion resistance

Link to Hubbard Hall Emerald Paint Prep 380 NP

 


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577M Rust Inhibitor

577M is a liquid inorganic rust inhibitor designed for treatment of steel and iron parts. 577M works by reacting with the surface of the steel and passivating it. There does not need to be any residual 577M left on the surface of the parts to provide protection. Parts can be welded, painted, plated or assembled without the additional step of removing the rust inhibitor. 577M contains an additional amine based rust inhibiting package formulated to provide extra rust protection in unique applications.

 

Performance Features

  • Provides in-process rust protection to iron or steel parts and to steel media during deburring operations.
  • Provides rust protection for short-term storage after cleaning or mass finishing of iron or steel parts.
  • Does not require parts to be re-cleaned before painting or heat treatment.
  • Compatible with most alkaline compounds when simultaneous use is required.
  • Contains an additional amine based rust inhibitor for greater rust protection.

 

577M Rust Inhibitor


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578 Rust Inhibitor

578 is a liquid, inorganic, Sodium Molybdate free, rust inhibitor designed for treatment of steel, iron, and yellow metal parts. 578 works by reacting with the surface of the metal and passivating it. There does not need to be any residual 578 left on metal surface to provide rust protection. Parts can be welded, painted, plated or assembled without the additional step of removing the rust inhibitor.

 

Performance Features

  • Provides in-process rust protection to iron, steel, or yellow metal parts.
  • Protects steel media during deburring operations.
  • Provides rust protection for short-term storage after cleaning or mass finishing of iron, steel, or yellow metal parts.
  • Does not require parts to be re-cleaned prior to painting or heat treatment.
  • Compatible with most alkaline compounds when simultaneous use is required.
  • Contains NO sodium molybdate – easily waste treated.

 

578 Rust Inhibitor


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585 Water Displacing Rust Inhibitor

585 is a petroleum based liquid rust inhibitor designed to protect metal parts during prolonged indoor storage after manufacturing or machining. 585 provides a transparent rust preventative film for easy visual inspection of identifying marks.

Performance Features

  • Forms a thin, soft protective film that will not run, wick, or crack when dry.
  • Provides up to one year or more of indoor rust protection.
  • Passes a 40 day corrosion test in a standard 100 degree F – 100% humidity cabinet.
  • Neutralizes fingerprints to prevent fingerprint corrosion.
  • Transparent film does not interfere with visual inspection of parts or reading of identifying marks.
  • Easily applied by dip, brush, low pressure spray or wiping.
  • Can be diluted with mineral spirits if a lighter film is needed.
  • Can be removed easily with solvents or hot alkaline cleaning compounds

 

585 Water Displacing Rust Inhibitor


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570 Rust Inhibitor

570 is a liquid organic rust inhibitor for indoor storage of steel and iron parts. 570 offers the best features of protecting the steel for in-house keep or further processing.

Performance Features

  • Seacole 570 is easy to rinse.
  • Seacole 570 is very economical to use.
  • Does not require parts to be re-cleaned before painting or heat treatment.
  • Provides rust protection for short term storage after cleaning for mass finishing of iron or steel parts.
  • Seacole 570 is compatible with most alkaline compounds.

 

570 Rust Inhibitor


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Dynamic Duo Kit

Dynamic Duo is an ultra high pH, heavy-duty detergent and degreaser engineered to attack grease, grime, soil or any other unwanted contaminants associated with high or low pressure cleaning applications. Dynamic Duo is a super concentrated chemistry capable of cleaning and degreasing industrial / commercial equipment, tankers, trucks, buses, and farm vehicles. Dynamic Duo will leave a streak free finish, brighter paint, clearer glass, and shiny wheels. Dynamic Duo is also extremely effective for removing tenacious road film.

 

Performance Features

  • Biodegradable and environmentally green.
  • Quickly removes grease, oils, and road film.
  • Contains NO harmful glycol ethers, phosphates, HAP’s, or VOC’s.
  • Super concentrated formula for low volume usage and low cost.
  • Packaged as an EZ Kit to eliminate high freight costs and storage / handling requirements.

 

Dynamic Duo Kit


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Powerbite Kit

Power Bite is a low foaming, heavy-duty liquid floor cleaner formulated to clean facility, warehouse, shop and garage floors. Power bite was engineered for automatic floor scrubbers to prevent excess foam problems. Power bite provides extra penetration of the toughest grease and oil laden floors and will not remove or harm common shop floor sealants.

 

Performance Features

  • Penetrates and removes heavy greases, oils, lubricants, and tire marks.
  • Will not attack contrete or common floor sealants.
  • Super concentrated formula for low volume usage and low cost.
  • Packaged as an EZ Kit to eliminate high freight costs and storage / handling requirements.
  • Engineered specifically for automatic floor scrubbers.

 

Powerbite Kit


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Superscrub Kit

Super Scrub is an economical liquid cleaner with Butyl formulated for general cleaning of all hard surfaces. Super Scrub is capable of cleaning and degreasing everything found in the office, factory, shop, bathroom, and kitchen. Super Scrub is virtually safe on all hard surfaces and rinses freely leaving a bright, film-free surface.

 

Performance Features

  • Safe on virtually all surfaces.
  • Rinses freely leaving a bright, film-free surface.
  • Contains no harmful polluting phosphates.
  • Non-Flammable.
  • Super concentrated formula for low volume usage and low cost.
  • Packaged as an EZ Kit to eliminate high freight costs and storage / handling requirements

 

Superscrub Kit


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Action Cleaner

Action Cleaner is a premium quality liquid cleaner with Butyl formulated for general cleaning of all hard surfaces. Action Cleaner is capable of cleaning and degreasing everything found in the office, factory, shop, bathroom, and kitchen. Action Cleaner is virtually safe on all hard surfaces and rinses freely leaving a bright, film-free surface.


Performance Features

  • Safe on virtually all surfaces.
  • Rinses freely leaving a bright, film-free surface.
  • Super concentrated formula for low volume usage and low cost.
  • Cleans well in both hot and cold water.

Action Cleaner


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AECL Neutral Cleaner

AECL is an all purpose, non-butyl, pH neutral cleaner safe for all surfaces where water is tolerable. AECL is mild to the hands and safe for use on walls, floors, interiors, painted surfaces, and all metals. AECL rinses freely and dries leaving a clean, bright, streak-free finish.


Performance Features

  • Works well in hot or cold water.
  • Safe for use on all hard surfaces where water is tolerable.
  • Excellent rinseablity leaving surface clean, bright, and residue/streak free.
  • No final rinse necessary.
  • Pleasant lemon scented fragrance.
  • Non-hazardous pH neutral formula.

AECL Neutral Cleaner


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Supersolv T

Supersolv MCS-T is a heavy-duty solvent emulsion cleaner especially formulated to remove tar and asphalt from heavy equipment and vehicles. Supersolv MCS-T can be applied by dip, brush, or spray.

 

Performance Features

  • Solubilizes tar, asphalt, and bituminous deposits to be quickly and easily removed by water rinse.
  • Safe for use on cars, trucks, heavy equipment, buildings, and concrete surfaces.
  • Significantly saves cleaning time over scraping and chipping methods.
  • Safe to use on all metals and on most painted surfaces
  • Has a milder odor than many competing rinseable solvents.

 

Supersolv T


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101 Vent and Hood Cleaner

101 is a free flowing powdered, highly alkaline cleaner formulated for use on ferrous metal for steam cleaning applications of commercial equipment.

Performance Features

  • Quickly removes baked on carbon deposits, oils, heavy greases, and other soils commonly found in janitorial, restaurant, and facility maintenance applications.
  • Excellent rinseability leaving equipment clean, bright and residue free.
  • Formulated with NO useless fillers delivering maximum usage life.

101 Vent and Hood Cleaner


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744 HD Kitchen Degreaser

744 is a USDA approved, heavy-duty alkaline cleaner for use in commercial kitchens, food plants, and janitorial applications.

 

Performance Features

  • Dissolves grease, greasy soil, food, crayon, pencil marks, and scuff marks.
  • Effective and safe for use on steel, brass, counter tops, floors, walls, and most hard surfaces.
  • Effective in pressure washing applications on kitchen vent stacks and hoods.
  • Rinses easily leaving a clean, film-free surface.

 

744 HD Kitchen Degreaser


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748 Oven Cleaner

748 is a heavy-duty, ready-to-use, thickened liquid designed for cleaning commercial ovens and grills. 748 is not recommended for use on aluminum or other sensitive metals.

 

Performance Features

  • Loosens baked on grease and food from oven and cooking surfaces for easy removal with a wet sponge.
  • An effective cleaner for ovens, grills, broilers, deep fat fryers, hoods and greasy vents.
  • Thickened to hold to surfaces for excellent soil contact.

748 Oven Cleaner


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919 Concentrated Glass Cleaner

919 is a heavy duty, ammonia/isopropyl based, ready-to-use general purpose glass and surface cleaner formulated for use in cold temperatures or on heavy soils. 919 can be diluted with up to 8 parts water for greater economy when used in warm temperatures.

 

Performance Features

  • Cleans and shines windows, windshields, appliances, counters, fixtures and everything made of glass, chrome, stainless steel, plastic, vinyl, glazed tile, and porcelain.
  • Removes soot, dust, grease, fingerprints and smudges.
  • Does not freeze in temperatures as low as -5 degrees F, making it ideal for window cleaning during winter weather.
  • May be diluted with up to 8 parts water for greater economy in warm temperature use.

919 Concentrated Glass Cleaner


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711 Trash Can Odor Control

711 is a powerful deodorizer formulated to attack offensive odors, organic or inorganic, that emanate from trash receptacles or dumpsters. 711 is a citrus scented powder capable of reaching into the toughest areas odor originates from. 711’s advanced formula attacks odors in two ways: first by breaking down the inorganic or organic substrate and encapsulating the incontinent particulates and second by overpowering the odor with a powerful citrus fragrance. Adding 711 to your everyday cleaning process ensures your customers and neighbors will never have to smell an unpleasant odor from your business!

 

Performance Features

  • Effective on both organic and inorganic odor substrates.
  • Highly concentrated with no useless fillers, provides longer usage and greater economy.
  • Pleasant citrus fragrance.
  • Biodegradable & non-hazardous.
  • Environmentally green.

711 Trash Can Odor Control


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NOR Deodorant

NOR Deodorant is a liquid odor neutralizer for use in general janitorial and odor control applications. NOR Deodorant neutralizes and eliminates odor emanating from toilets, garbage cans, disposals, pet accidents, or anywhere noxious odor exists. NOR Deodorant is safe for use when mixed with water based cleaning solutions.

 

Performance Features

  • Effectively kills most odors.
  • Effective on animal smells, urine, vomit, smoke, and other odors.
  • ‰Can be safely used on fabrics, carpets, upholstery, and on hard or porous surfaces.
  • Can be mixed with water based cleaning solutions to neutralize odors as you clean.

 

NOR Deodorant


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640 Carpet Cleaner

640 is a medium duty, concentrated liquid shampoo for truck mount or portable extraction carpet cleaning equipment.

 

Performance Features

  • Cleans general soil and dirt for effective extraction.
  • Brightens colors.
  • Deodorizes leaving a light, fresh lemon scent.
  • Does not contribute particles to clog equipment nozzles.
  • Extracts cleanly without leaving dirt-attracting residue.

 

640 Carpet Cleaner


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782 Stainless Steel Polish

Clean Look 782 is a specially formulated stainless steel cleaner and polish engineered to restore industrial kitchen and food plant appliances, counters, and cabinets back to their original shine. Clean Look 782 is a mineral oil based formula that provides a protective polish on all stainless steel combating contaminants such as grease, greasy soil, heavily baked on foodstuff, carbonaceous soil, and any other contaminates associated with cooking. Clean Look 782 provides a professional, sanitary, and ultra-clean sparkle to stainless steel that exceeds all industry cleanliness standards.

 

Performance Features

  • Combats grease, soil, baked on foodstuff, smudges, and soot from building up.
  • Protects stainless steel.
  • Cleans and restores stainless steel back to its original shine.

 

782 Stainless Steel Polish


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DDC Bowl and Tile Cleaner

DDC is an acidic, general purpose cleaner for porcelain, enamel, ceramic tile and toilet bowls for use in schools, colleges and office buildings.

 

Performance Features

  • Quickly removes hard water iron and mineral deposits, and soap curd.
  • Safe and effective on porcelain, baked enamel, glazed tile, chrome, and stainless steel in shop sinks, bathroom fixtures, and kitchens.
  • Kills odor causing bacteria.
  • Harmless to plumbing and septic tanks.
  • Effectively inhibits the growth of mold and mildew and odors they cause when applied as directed.

 

DDC Bowl and Tile Cleaner


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Seaclean 125B

Seaclean 125B is a specially formulated alkaline cleaner for draft beer line cleaning. Seaclean 125B reduces surface tension between unwanted beer deposits. Seaclean 125B is a highly concentrated formula rendering low usage volume for greater economy. Seaclean 125B is dyed with a blue indicator to safely determine when Seaclean 125B is in the line and when it has been safely flushed out.

 

Performance Features

  • Dyed blue for operator safety.
  • Highly concentrated for greater economy.
  • Cleans and removes unwanted beer deposits.

 

Seaclean 125B


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562 Burnishing Compound

562 is a mildly acidic liquid compound especially designed for burnishing non-ferrous metals in mass finishing systems with steel media.

 

Performance Features

  • Safe for use on all metals.
  • Delivers good lubricity for high-quality burnishing
  • Provides cleaning, deburring and burnishing actions.
  • Saves time by performing all functions in one step in some instances.
  • Maintains steel media in bright and clean condition.
  • Rejuvenates tarnished media.
  • Mixes readily and creates no undissolved particles to pack into holes or crevices.

 

562 Burnishing Compound


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543 Burnishing Compound

543 is an economical, liquid compound designed for burnishing all metals in mass finishing systems.

 

Performance Features

  • Safe for use on all metals.
  • Provides good lubricity for high quality burnishing.
  • Provides both cleaning and burnishing actions.
  • Prevents steel media from rusting and maintains bright and clean finish.
  • Creates NO undissolved particles to pack into holes or crevices or drain systems.

 

543 Burnishing Compound


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590 Burnishing Compound

590 is a highly concentrated, liquid compound designed for burnishing all metals in mass finishing systems.


Performance Features

  • Safe for use on all metals.
  • Provides good lubricity for high quality burnishing.
  • Provides both cleaning and burnishing actions.
  • Prevents steel media from rusting and maintains bright and clean finish.
  • Creates NO undissolved particles to pack into holes or crevices or drain systems

 

590 Burnishing Compound


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502 Deburring Compound

502 is an efficient, non-chromated, heavy-duty cleaning and deburring compound for mass finishing of cast iron, steel and stainless steel parts. 502 is formulated with an in-process rust inhibitor to protect parts from rusting during finishing.

 

Performance Features

  • Removes oils, greases, shop soils, rust protective films and other contaminants.
  • Keeps media clean and free of contaminants.
  • Maintains low foam in agitated systems.
  • Protects parts from rusting during processing.
  • Excellent for preparing steel parts prior to zinc or cadmium plating

 

502 Deburring Compound


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559 Deburring Compound

559 is an excellent, non-chromated, liquid cleaner for use in deburring and grinding operations of steel, and cast iron. 559 is formulated with an advanced in-process rust inhibitor and anti-foam protection package.

 

Performance Features

  • Removes oils, greases, shop soils, rust protective films and other contaminants.
  • Keeps media clean and free of contaminants.
  • Mixes easily without agitation, leaving no undissolved particles to pack into holes or crevices, or to plug drain system as some powders might.
  • Maintains low foam in agitated systems.
  • Protects parts from rusting and corrosion during processing.
  • Does not have the tissue irritating symptoms and toxic hazards of a chromate based product.

 

559 Deburring Compound


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517 Deburring Compound

517 is an excellent non-chromated cleaner and deburrer for use on all metals in grinding and deburring operations.

 

Performance Features

  • Particularly suitable for brass, zinc, and aluminum die castings, as well as all ferrous and non-ferrous metals and plastics.
  • Removes oils, grease, shop soils, rust protective films and other contaminants.
  • Keeps the media free of contaminants.
  • Keeps a low foam in agitated systems.
  • Protects parts from rusting and corrosion during processing.
  • Does not have the tissue irritating and toxic hazards of chromate.
  • Neutralizes acid cleaner residues after scale removal.

 

517 Deburring Compound


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527 Deburring Compound

527 is a blended, non-chromated, abrasive powder with specialty cleaners and corrosion inhibitors formulated for use in vibrating deburring systems with no media, part-on-part applications.

 

Performance Features

  • Deburrs and cleans small parts without additional media.
  • Removes oils, grease, shop soils, rust protective films and other contaminants.
  • Safe and effective with all metals.
  • Formulated to maintain its abrasiveness during extended deburring cycles.
  • Keeps a low foam in agitated systems.
  • Protects parts from rusting and corrosion during processing.
  • Does not have the tissue irritating and toxic hazards of chromate.

 

527 Deburring Compound


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555 Deburring Compound

555 is a liquid version of our popular 517 cleaning and deburring compound. 555 is an excellent non-chromated liquid cleaner for use on all metals in deburring and grinding operations. 555 is formulated with an advanced in-process rust protection and anti-foam package.

 

Performance Features

  • Suitable at any concentration for zinc and even the most sensitive aluminum die castings, as well as all ferrous and non-ferrous metals and plastics.
  • Removes oils, grease, shop soils, rust protective films and other contaminants.
  • Keeps the media free of contaminants.
  • Mixes easily without agitation, leaving no undissolved particles to pack into holes or crevices, or to plug the drain system as some powders might.
  • Keeps a low foam in agitated systems.
  • Protects parts from rusting and corrosion during processing.
  • Does not have the tissue irritating and toxic hazards of chromate.

 

555 Deburring Compound


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556 Deburring Compound

556 is an aluminum safe, high pH, multipurpose degreaser and detergent engineered to attack grease, grime, soil or any other unwanted contaminants associated with cleaning. 556 is a medium duty, super concentrated, non-butyl formula capable of cleaning and degreasing difficult soils, greases, and other contaminants associated with mass finishing. 556 is formulated with an advanced corrosion / rust inhibitor package to prevent flash rusting and to provide short-term indoor rust / corrosion inhibition. 556 is safe to use anywhere water is tolerable.

 

Performance Features

  • Biodegradable and environmentally green.
  • Contains NO harmful glycol ethers, phosphates, HAP’s, or VOC’s.
  • Will not attach paint or rubber seals.
  • Multi-metal safe / use anywhere water is tolerable.
  • Super concentrated formula for low volume usage and low cost.
  • Formulated with an advanced corrosion / Rust inhibitor package.

 

556 Deburring Compound


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558G Deburring Compound

558G is an excellent non-chromated cleaner for use on all metals in grinding and deburring operations. 558G is formulated with an advanced in-process rust protection and anti-foam package.

 

Performance Features

  • Particularly suitable for brass, zinc, and aluminum die castings, as well as all ferrous and non-ferrous metals and plastics.
  • Removes oils, grease, shop soils, rust protective films and other contaminants.
  • Keeps the media free of contaminants.
  • Maintains low foam in agitated systems.
  • Protects parts from rusting and corrosion during processing.
  • Does not have the tissue irritating and toxic hazards of a chromate based cleaner

 

558G Deburring Compound


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561 Derusting Compound

Seacole 561 is an acid cleaner/descaler containing a blend of inorganic acids and surfactants to remove heavy soils quickly and effectively. It is also used to descale steel surfaces.

 

Performance Features

  • Seacole 561 is easy to rinse.
  • Seacole 561 is very economical to use.
  • Is a combination cleaner/descaler.
  • Seacole 561 is quick and effective.

 

561 Derusting Compound


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531 Descaler

531 is a powdered, multi-metal safe, acid based scale remover and cleaner formulated for use in mass finishing systems.

 

Performance Features

  • Removes rust, oxides, mill scale and heat scale.
  • Provides faster descaling than alkaline scale removers.
  • Appropriate for use on most metals.
  • Can be used in open or vented closed systems.

 

531 Descaler


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543A Sheet Metal Forming Lube

543A is a sheet metal forming lube designed to be used in a wide variety of applications and severities. It performs on both ferrous and non-ferrous metals and can be used for either stamping, punching, bending, or forming.

 

Performance Features

  • Excellent lubricity.
  • Good rust protection.
  • Capable of being cleaned off easily.
  • Contains NO VOC’s or HAP’s.

 

543A Sheet Metal Forming Lube


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Seaclean 30NS

Seaclean 30NS aluminum cleaner is a one step non-etching cleaner specifically designed to clean and activate aluminum prior to further processing. It is specially developed for cleaning heavy oils from aluminum, steel, brass and copper.

 

Performance Features

  • Non-silicated.
  • Easy to rinse.
  • No phosphates
  • No glycol ethers.
  • Very economical to use.
  • Removes all soils and organic residues from metal surfaces.
  • Biodegradable and environmentally safe.

 

Seaclean 30NS


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Seaclean 130

Seaclean 130 is a concentrated alkaline cleaner specifically designed for electro cleaning copper, steel and other ferrous metals.

 

Performance Features

  • Provides excellent surface wettability.
  • Removes soils, grease and other organic surface residues.
  • Provides long bath life.
  • Provides long bath life.
  • Is economical to use.
  • Biodegradable; easy to waste treat.

 

Seaclean 130


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Seaclean 135

Seaclean 135 is a concentrated alkaline cleaner / degreaser specifically designed for cleaning and degreasing copper, steel and a complete line of ferrous metals.

 

Performance Features

  • Easily removes soils, grease, organic and carbon residues from metal surfaces.
  • Works quickly and effectively over a wide temperature range.
  • Easily rinseable, thus reduces rinse cycle time.
  • Very economical to use.
  • Biodegradable; easy to waste treat.
  • Non-chelated.

 

Seaclean 135


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Seaclean 150

Seaclean 150 is a concentrated alkaline, non-phosphated cleaner specifically designed for electro cleaning copper, steel and other ferrous metals.

 

Performance Features

  • Provides excellent surface wettability.
  • Removes soils, grease and other organic surface residues.
  • Provides long bath life.
  • Is economical to use.
  • Biodegradable; easy to waste treat.
  • Non-phosphated.

 

Seaclean 150


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Seaclean EL

Seaclean EL is an inhibited alkaline liquid detergent for maintenance or production cleaning of electrical equipment and metal parts, aircraft components or other parts requiring low residue, in high-pressure spray wash cabinet and conveyer systems.

 

Performance Features

  • Quickly removes grease, oils, carbonaceous soils, and other soils.
  • Leaves no residue after rinsing to avoid conductivity problems in motor windings. Will not attack electrical insulation and varnishes.
  • Contains no glycol ethers, HAPS or VOC’s, and is biodegradable and environmentally safe.
  • Long bath life and low use concentrations provide exceptional value with low use costs.
  • Provides operator safety. Will not erupt when mixed in hot water like caustic-based products.
  • Will not build excess foam in spray cabinets at operating temperatures (above 140 degrees F).
  • Contains no silicone to interfere with new coatings or paint.
  • Aerospace Qualified – Conforms to Boeing D6-17487, Douglas CSD #1, and AMS 1526B.
  • Excellent with ultra-filtration systems.

 

Seaclean EL


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Seacole Product Tags: ,

Acid Etch AL200

Acid Etch AL200 is formulated for use in the pretreatment cycle of aluminum alloys. It’s an excellent mild etch for aluminum and aluminum alloys prior to electroless nickel, anodizing, welding or applying chemical conversion coatings. It is very uniform, controlled etching action produces a brighter, cleaner surface and has minimal effect on the dimensions of the work. Acid Etch AL200, with its excellent deep-recess penetration and its long life, cleans hard to get at places and holds soil in suspension in the bath at high capacities, which reduces or virtually eliminates smut formation on the work.

Acid Etch AL200 is especially effective on difficult to plate alloys, particularly those rich in magnesium. It is ideal for high finish aluminum surfaces because it does not appreciably change the appearance of polished aluminum.


Performance Features

  • Uniform etching action produces fewer rejects and increased productivity.
  • Effective for pretreating parts where close tolerance is a factor.
  • Provides for maximum adhesion and complete plate coverage.
  • Minimizes or eliminates smut formation on the work.
  • Less dumping for economical operation.
  • Contains no chelates and is non-fuming at room temperature.
  • Minimizes problems associated with waste treatment.

Acid Etch AL200


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Seacole Product Tags:

Aluminum Etch 25

Aluminum Etch 25 is an alkaline material which uniformly etches aluminum alloys. Etch 25 minimizes the formation of aluminum scale in tanks and on heating elements.

Performance Features

  • Minimizes formation of scale.
  • Economical – highly concentrated.
  • Capable of being used at wide range of operating parameters.

 

Aluminum Etch 25


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Seacole Product Tags:

Aluminum Etch 40

Aluminum Etch 40 is an alkaline material which uniformly etches aluminum alloys. Etch 40 minimizes the formation of aluminum scale in tanks and on heating elements. Etch 40 exhibits a larger holding capacity for aluminum producing longer bath life and greater economy.


Performance Features

  • Minimizes formation of scale.
  • Economical – highly concentrated.
  • Formulated with larger holding capacity for aluminum for maximum bath life.
  • Capable of being used at wide range of operating parameters.

 

Aluminum Etch 40


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Seacole Product Tags:

Seacole Aluminum and Magnesium Conditioner

Seacole Aluminum and Magnesium Conditioner is an acidic liquid conditioner specially formulated for use in the pre-treatment cycles for aluminum and magnesium alloys prior to electroless nickel plating. Seacole Aluminum and Magnesium Conditioner is especially effective for difficult to plate alloys, particularly those rich in magnesium. For applications where minimal dimensional changes and maximum reflectivity are required, Seacole Aluminum and Magnesium Conditioner is ideal. Seacole Aluminum and Magnesium Conditioner is also preferred for high-finish aluminum and magnesium surfaces because it does not appreciably change the appearance of polished aluminum or magnesium.

Seacole Aluminum and Magnesium Conditioner is an excellent mild conditioner for aluminum, aluminum alloys, and magnesium alloys prior to electroplating, anodizing, welding or application of chemical conversion coatings. The absence of residual, slimy aluminum or magnesium slats insures a clean surface for subsequent finishing operations. Seacole Aluminum and Magnesium Conditioner is free of chelators, thus making it very easy to waste treat.

Performance Features

  • Seacole Aluminum and Magnesium Conditioner is very uniform and provides controlled etching action and increased productivity.
  • Produces bright, smooth surface.
  • Mild conditioner having minimal effect on dimensions of work.
  • Excellent deep recess penetration.
  • Minimizes or eliminates smut formation on the work.
  • Chelator free.
  • Non-fuming at room temperature.
  • Uniform etching action produces fewer rejects and increased productivity.
  • Provides for maximum adhesion.
  • Effective for pretreating parts where close tolerance is a factor.
  • Complete plate coverage at reduced cost.
  • Minimizes problems associated with waste treatment.
  • Fewer corrosion problems surrounding equipment.

 

Seacole Aluminum and Magnesium Conditioner


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Seacole Product Tags:

Fume Suppressant 1000

Fume Suppressant 1000 is a liquid fume suppressant specifically designed to suppress fumes that are generated during anodizing operation. It generates a foam blanket on the surface of the tank that prevents irritating acid fumes.


Performance Features

  • Easy to rinse.
  • Does not chelate metals.
  • Very economical to use.
  • Safe to handle.

 

Fume Suppressant 1000


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Seacole Product Tags:

Iron Phosphate 450

Iron Phosphate 450 is a highly concentrated, liquid solution specifically designed to clean and phosphatize ferrous metals in spray wand applications prior to painting.

 

Performance Features

  • Contains NO sodium molybdate.
  • Forms a stable, inert coating on ferrous metal surfaces.
  • Provides excellent paint adhesion results.
  • Produced optimum ASTM test results.
  • Forms a smooth, dense, iron phosphate conversion coating.

 

Iron Phosphate 450


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PHL

PHL is a highly concentrated, liquid solution specifically designed to clean and phosphatize ferrous metals in spray wand applications prior to painting.

Performance Features

  • A good cleaner for removing dirt and light oil common to freshly manufactured parts.
  • Provides both cleaning and phosphatizing actions in one step.
  • Improves quality of finished parts by improving paint adhesion, resistance to peeling, and undercutting.
  • Prepares metal surface for a strong bond with paint.
  • Will not foam escessively in pressure wash applications.

 

PHL


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QRD Adjuster

QRD Adjuster is a concentrated solution of organic additives specifically formulated for use with bright nickel plating. An addition of QRD Adjuster selectively increases the amount of kicker components in an operating bath without altering the concentrations of other bath components.


Performance Features

  • Reduce the concentration of leveler when it is too high.
  • Compensate for a very high total carrier concentration.
  • Increase leveling in an operating process when the concentrations of the additives are within the proper range.
  • Compensate for the higher consumption of kicker brightener components that is common in barrel plating operations.

 

QRD Adjuster


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Seacole Product Tags:

RACK/Stripper 35

RACK/Stripper 35 is a stabilized nitric acid solution designed to effectively strip tin, solder and copper from plating racks. RACK/Stripper 35 can hold in excess of 20 ounces per gallon of metal, does not contain peroxides or persulfates, or fluoborates, and is easily waste treated via simple pH adjust when spent.


Performance Features

  • RACK/Stripper 35 can be operated at room temperature or mildly heated to speed stripping speed.
  • Due to high metal loading, RACK/Stripper 35 is very economical.
  • RACK/Stripper 35 does not contain peroxides, persulfates, or fluoborates and is thus easy to employ and waste treat.

 

Rack/Stripper 35


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Seacole Product Tags:

Fresh Again® Athletic

Concentrated in the enclosed environment of a shoe or boot, foot perspiration can create personal embarrassment, make lockers and closets unpleasant, and cause expensive equipment to stiffen and rot. Fresh Again® for Athletic Wear and Shoes neutralizes the perspiration itself, even in porous material and foam!

Link to Fresh Again Athletic Wear & Shoes TDS


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Seacole Product Tags:

Fresh Again® Uniform/Costume

Uniformed workers perspire, and so do performers under hot lights. Dry cleaning uniforms and costumes is expensive and can also complicate time schedules. But now you can dispel those perspiration odors everyday – instantly – simply by using Fresh Again® for Uniforms and Costumes!


Using Fresh Again® for Uniforms and Costumes prevents the rotting damage caused by perspiration to fabrics, stitching, foams and leather. Use before wearing or before storage. Dry cleaning does not remove perspiration odors, in fact, it sets it in. The use of Fresh Again® before dry cleaning permits total cleaning.


Some of our enthusiastic customers include: theatres, military schools, circuses, fire fighters, costume rental stores, TV stations, bands, choirs, police and the entertainment industry.

Fresh Again® Uniform/Costume


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Seacole Product Tags:

685C Chemical Toilet

685C is a highly concentrated liquid odor control solution for use in chemical toilets on airplane, train, RV, bus, and portable toilet applications.

 

Performance Features

  • Contains NO formaldehyde.
  • Super concentrated.
  • Environmentally safe.
  • Superior odor control effective on human feces, urine, vomit, smoke, and other odors.

 

685C Chemical Toilet


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688S Chemical Toilet- Summer

688S is a ready-to-use liquid odor control agent for summer use in chemical toilets on airplane, train, RV, bus, and portable toilet applications.

Performance Features

  • Ready-to-use summer formula.
  • Contains NO hazardous or toxic ingredients. NO formaldehyde.
  • Employs a pleasant scent to cover odor as well as a special agent for suppression of odor.
  • Reduced dye content to minimize risk of staining skin and equipment.
  • Formulated with detergents to improve clean-out and rinsing.
  • Cost effective and easy to use.

 

688S Chemical Toilet- Summer


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688W Chemical Toilet – Winter

688W is a ready-to-use liquid odor control agent containing antifreeze for winter use in chemical toilets on airplane, train, RV, bus, and portable toilet applications.

Performance Features

  • Ready-to-use winter formula.
  • Contains NO hazardous or toxic ingredients. NO formaldehyde.
  • Employs a pleasant scent to cover odor as well as a special agent for suppression of odor.
  • Reduced dye content to minimize risk of staining skin and equipment.
  • Formulated with detergents to improve clean-out and rinsing.
  • Cost effective and easy to use.
  • Provides protection from freezing down to -40 degrees F.

 

688W Chemical Toilet – Winter


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BASIC/Lean SC-10

BASIC/Lean SC-10 is a highly concentrated, non-etching, alkaline cleaner/degreaser designed specifically to remove organic residues from copper foil to assure a uniformly clean surface prior to further processing. BASIC/Lean SC-10 is particularly effective at penetrating and removing organic material from porous copper surfaces. It can be operated at concentrations of 5-30% and temperatures of 120-180F. Performance Features BASIC/Lean SC-10 was specifically formulated to prepare copper surfaces prior to further processing improving uniformity of micro-etching, oxide deposition, etc. BASIC/Lean SC-10 penetrates and removes organic residues from copper foil; including fingerprints, light oils, and photoresist residues. BASIC/Lean SC-10 is highly concentrated. BASIC/Lean SC-10 available in formulations suitable for spray or immersion applications.

BASIC/Lean SC-10


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Seacole Product Tags:

CHROME/Clean AC-1

CHROME/Clean is a concentrated, non-etching, free-rinsing acid cleaner designed specifically to remove chromate and zincate anti-tarnish costings from copper foil. It will also remove light oils, fingerprints, and oxidized copper from copper surfaces prior to resist lamination and/or hot air solder leveling. CHROME/Clean can be operated at concentrations of 5-20% and temperatures of 70-140F and is available in formulations suitable for either spray (AC-1S) or immersion applications (AC-1).

CHROME/Clean contains oxidation inhibitors to inhibit copper oxidation prior to further processing. These inhibitors will also promote dry film adhesion. It should not be used as a pre-clean prior to electrolytic or immersion plating applications without first consulting Seacole.

Performance Features

  • CHROME/Clean is specifically formulated to remove chromate and zincate anti-tarnish coatings from copper foil, and is also effective at removing fingerprints, light oils, and existing copper oxidation.
  • CHROME/Clean offers a wide process latitude and is ideally suited for feed and bleed operation.
  • CHROME/Clean is formulated with oxidation inhibitors to prevent copper oxidation between processing steps and promote adhesion of dry film.
  • CHROME/Clean is formulated for either spray (AC-1S) or immersion applications (AC-1).

 

CHROME/Clean AC-1


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CHROME/Clean AC-1S

CHROME/Clean is a concentrated, non-etching, free-rinsing acid cleaner designed specifically to remove chromate and zincate anti-tarnish costings from copper foil. It will also remove light oils, fingerprints, and oxidized copper from copper surfaces prior to resist lamination and/or hot air solder leveling. CHROME/Clean can be operated at concentrations of 5-20% and temperatures of 70-140F and is available in formulations suitable for either spray (AC-1S) or immersion applications (AC-1).

CHROME/Clean contains oxidation inhibitors to inhibit copper oxidation prior to further processing. These inhibitors will also promote dry film adhesion. It should not be used as a pre-clean prior to electrolytic or immersion plating applications without first consulting Seacole.

Performance Features

  • CHROME/Clean is specifically formulated to remove chromate and zincate anti-tarnish coatings from copper foil, and is also effective at removing fingerprints, light oils, and existing copper oxidation.
  • CHROME/Clean offers a wide process latitude and is ideally suited for feed and bleed operation.
  • CHROME/Clean is formulated with oxidation inhibitors to prevent copper oxidation between processing steps and promote adhesion of dry film.
  • CHROME/Clean is formulated for either spray (AC-1S) or immersion applications (AC-1).

CHROME/Clean AC-1S


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ENVIRO/Etch Make-Up

ENVIRO/Etch (ENVIRO/Etch) is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes. ENVIRO/Etch leaves a uniformly clean and micro-roughened copper surface, promoting improved dry film to copper adhesion, copper to copper adhesion, and HAL solder to copper adhesion.

ENVIRO/Etch can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. ENVIRO/Etch is capable (based upon concentrations at make-up) of etching copper at rates from 10-800 micro-inches per minute, making it versatile enough to be operated as a continuous spray final etch.

Performance Features

  • ENVIRO/Etch exhibits stable, predictable etch rates over a wide range of copper concentrations; making it ideal for many different applications including:
  • Pre-lamination cleaning
  • Enhancing topography prior to oxide
  • Promoting Optimum HAL coverage
  • Promoting copper to copper adhesion
  • Promoting copper to alternative finish adhesion
  • ENVIRO/Etch can be continuously operated employing a chiller to precipitate cupric sulfate, minimizing waste treatment costs.

 

ENVIRO/Etch Make-Up


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Seacole Product Tags:

ENVIRO/Etch Replenisher

ENVIRO/Etch (ENVIRO/Etch) is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes. ENVIRO/Etch leaves a uniformly clean and micro-roughened copper surface, promoting improved dry film to copper adhesion, copper to copper adhesion, and HAL solder to copper adhesion.

ENVIRO/Etch can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. ENVIRO/Etch is capable (based upon concentrations at make-up) of etching copper at rates from 10-800 micro-inches per minute, making it versatile enough to be operated as a continuous spray final etch.

Performance Features

  • ENVIRO/Etch exhibits stable, predictable etch rates over a wide range of copper concentrations; making it ideal for many different applications including:
  • Pre-lamination cleaning
  • Enhancing topography prior to oxide
  • Promoting Optimum HAL coverage
  • Promoting copper to copper adhesion
  • Promoting copper to alternative finish adhesion
  • ENVIRO/Etch can be continuously operated employing a chiller to precipitate cupric sulfate, minimizing waste treatment costs.

 

ENVIRO/Etch Replenisher


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Seacole Product Tags:

ENVIRO/Bright SC-2

ENVIRO/Bright SC-2 is a concentrated, acidic cleaner used to clean and deoxidize unfused tin-lead surfaces prior to hot oil fusing. ENVIRO/Bright SC-2 is designed to remove metallic oxides, light oils and organic contaminants; while at the same time neutralizing alkaline etch residues. Unlike conventional solder conditioners, ENVIRO/Bright SC-2 can withstand significant copper contamination prior to losing its effectiveness. The product is suitable for either spray or immersion applications, and is ideally suited for feed and bleed applications.

Performance Features

  • ENVIRO/Bright SC-2 is specifically formulated to remove fingerprints, light oils, alkaline etch residue and metallic oxides from unfused tin-lead surfaces.
  • ENVIRO/Bright SC-2 offers a wide process latitude and is ideally suited for feed and bleed operation.
  • ENVIRO/Bright SC-2 is a concentrate employed at 10-40% by volume, and can be replenished on a fed/bleed basis.
  • ENVIRO/Bright SC-2 tolerates copper concentrations exceeding 800 mg/l improving performance and minimizing dump frequency.

 

ENVIRO/Bright SC-2


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Seacole Product Tags:

ENVIRO/Bright SC-5

ENVIRO/Bright SC-5 is formulated to remove oxides and alkaline or acidic etch residues from solder plated printed circuit boards and to activate copper surfaces. ENVIRO/Bright SC-5 not only removes oxides, but cleans and brightens solder. With mild odor, the economical, concentrated formula can be used in either spray or dip applications. ENVIRO/Bright SC-5 is free rinsing in water and may be operated at ambient temperature.


Performance Features

  • ENVIRO/Bright SC-5 is specifically formulated to remove fingerprints, light oils, alkaline or acidic etch residues from solder plated printed circuit boards.
  • ENVIRO/Bright SC-5 offers a wide process latitude and is ideally suited for feed and bleed operation.
  • ENVIRO/Bright SC-5 is free rinsing and may operate at ambient temperatures.

 

ENVIRO/Bright SC-5


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Seacole Product Tags:

RINSE/Aid AH-1

RINSE/Aid AH-1 (AH-1) is a highly concentrated, mild alkaline cleaner designed to aid in the removal of post hot air level residues, including organic and inorganic residue which may contribute to ionic contamination. The AH-1 formulation is effective solubilizing both thermally adhered ethoxylated polymers, as well as metal oxides and metal halides that may form on the surface of the PCB during hot air level processing. AH-1 can be operated at concentrations of 5-20% in water, at temperatures of 70-140F, and is suitable for either spray or immersion applications.

Performance Features

  • RINSE/Aid AH-1 is effective solubilizing both organic and inorganic residue that may form on the surface of the PCB during hot air level processing.
  • RINSE/Aid AH-1 is an economical concentrate, used at concentrations as low as 5% in water.
  • RINSE/Aid AH-1 is compatible with most types of equipment and will not attack or soften elastomers.
  • RINSE/Aid AH-1 reduces ionic contamination after hot air leveling.

 

RINSE/Aid AH-1


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Seacole Product Tags:

AUTO/Prep DS-2

AUTO/Prep DS-2 is the second step in the AUTO/Prep Desmear-Etchback Process and is designed to remove resin smear and expose interconnects, while at the same time optimizing the surface topography of the dielectric for eventual electroless copper deposition. AUTO/Prep DS-2 removes the softened dielectric (resulting from AUTO/Prep hole swell treatment) and drill debris by selective oxidation, thus enhancing the uniformity and topography of the hole wall. AUTO/Prep DS-2 features process flexibility (applicable for a variety of resin systems), long solution life (when electrolytically or chemically regenerated), and ease of operation.

Performance Features

  • AUTO/Prep DS-2 is potassium permanganate-based to reduce the cost for desmear applications.
  • AUTO/Prep DS-2 can be used to desmear a variety of resin systems including FR-4 and polyimide.
  • AUTO/Prep DS-2 is easy to control, yielding consistent etch rates and reproducible results.
  • AUTO/Prep DS-2 can be chemically or electrically regenerated, improving bath life and enhancing etch rate control.
  • AUTO/Prep DS-2 in conjunction with AUTO/Prep HS Series increases hole wall topography promoting improved electroless copper coverage and adhesion.

 

AUTO/Prep DS-2


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Seacole Product Tags:

AUTO/Prep GE-4

AUTO/Prep GE-4 is the fourth step in the AUTO/Prep Desmear-Etchback Process designed to remove resin smear and expose interconnects, and at the same time optimize the surface topography of the dielectric for eventual electroless copper deposition. AUTO/Prep GE-4 will remove silica residues adhering to the glass bundles after desmear-etchback AND etchback or frost protruding or exposed glass fibers providing a clean hole wall ideal for electroless copper deposition. AUTO/Prep GE-4 features process flexibility, minimal copper attack (non-ammoniated formulation), and long solution life.

Performance Features

  • AUTO/Prep GE-4 is a non-ammoniated formulation thus reducing copper attack and complexing for ease of waste treatment.
  • AUTO/Prep GE-4 will completely remove silica residue and frost or etchback protruding glass fibers leaving a clean hole wall for optimum electroless deposition and adhesion.
  • AUTO/Prep GE-4 offers long solution life and minimal operator maintenance for ease of use.
  • AUTO/Prep GE-4 exhibits very low surface tension, ensuring small hole wetting and penetration, thus enhancing product performance.
  • AUTO/Prep GE-4 can be combined with AUTO/Prep NU-3 Neutralizer to reduce the number of process steps.

 

AUTO/Prep GE-4


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Seacole Product Tags:

AUTO/Prep HS-110S

AUTO/Prep HS-110S is the first step in the AUTO/Prep desmear-etchback process designed to remove resin smear, expose interconnects, and at the same time optimize the surface topography of the dielectric for eventual electroless copper deposition. AUTO/Prep HS-110S softens the dielectric, enhancing the uniformity and topography of permanganate desmear-etchback. AUTO/Prep HS-110S features process flexibility, long solution life, ease of operation, and is recyclable.

Performance Features

  • AUTO/Prep HS-110S can be operated at 50-100% by volume depending upon the desired rate and depth of desmear and/or etchback offering flexibility and economy.
  • AUTO/Prep HS-110S is safe, non toxic, biodegradable, pH neutral, and recyclable when spent.
  • AUTO/Prep HS-110S offers long solution life and minimal operator maintenance for ease of use.
  • AUTO/Prep HS-110S will yield excellent hole wall topography when used in conjunction with AUTO/Prep DS-2, improving electroless copper deposition and adhesion on most dielectrics.
  • AUTO/Prep HS-110S exhibits very low surface tension, ensuring small hole wetting and penetration, thus enhancing the permanganate desmear-etchback process.
  • AUTO/Prep HS-110S is suitable for use with most dielectrics.

 

AUTO/Prep HS-110S


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Seacole Product Tags:

AUTO/Prep NU-3

AUTO/Prep NU-3 is the third step in the AUTO/Prep Desmear-Etchback Process designed to remove resin smear and expose interconnects, and at the same time optimize the surface topography of the dielectric for eventual electroless copper deposition. AUTO/Prep NU-3 will neutralize permanganate and manganese dioxide residues adhering to the hole wall after desmear-etchback thus providing a clean hole wall ideal for electroless deposition. AUTO/Prep NU-3 features process flexibility (can be incorporated with a glass etch), minimal copper attack (non-chloride formulation), and a long solution life.

Performance Features

  • AUTO/Prep NU-3 is a non-chloride formulation reducing copper attack for easier waste treatment.
  • AUTO/Prep NU-3 will completely dissolve permanganate, manganite, and magnesium dioxide, leaving a clean hole wall for optimum electroless deposition and adhesion.
  • AUTO/Prep NU-3 offers long solution life and minimal operator maintenance for ease of use.
  • AUTO/Prep NU-3 exhibits very low surface tension, ensuring small hole wetting and penetrating, thus enhancing permanganate neutralization.
  • AUTO/Prep NU-3 can be combined with AUTO/Prep GE-4 to reduce the number of process steps.

 

AUTO/Prep NU-3


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Seacole Product Tags:

DS-44 Developer Concentrate

DS-44 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imaged solder masks. DS-44 contains a chemical stabilizer and optional cleaners. Unlike conventional stabilizers, the PC-Series stabilizers do significantly increase the pH of the solution, and thus can be employed at concentrations high enough to obtain 15-20% more throughput through the same volume of chemistry.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with SEACOLE’S PC-AUTO/Controller and Dosing Device, the DS-44 Developer bath may be operated for 4-20 weeks continuously and without dumping (depending upon throughput). The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

 

Performance Features

  • DS-44 is formulated with a unique hard water scale inhibitor which will not dull fused solder during LPI solder mask processing.
  • DS-44 is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • DS-44 is stabilized, improving process consistency and improving bath life by 20%.

 

DS-44 Developer Concentrate


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Seacole Product Tags:

PC-45S and PC-45R TWO-PART DEVELOPER

PC-45 DEVELOPER is a carbonate based, two-part liquid developer concentrate for developing fully aqueous dry films. PC-45S Starter is a buffered potassium carbonate based solution, incorporating hard water scale inhibitors, rinse aids, and equipment cleaners. PC-45S is formulated to exhibit a pH of 10.8-11.0 upon make-up, at a total carbonate concentration of 1.0% by weight (10/gL). A pH upon make-up of 10.8-11.0 minimizes the potential for overdeveloping when preparing new developing baths. Additionally, PC-45S incorporates the same additive package as PC-450C, assuring optimum developer performance even when water quality is marginal.

PC-45R Replenisher is employed to replenish working developing baths in combination with automated feed/bleed replenishment systems. PC-45R chemically regenerates bicarbonate into usable (available) carbonate, significantly reducing the volume of fresh carbonate required to maintain the pH. When used in combination with Seacole’s PC-AUTO/Controller, the PC-Series Developer baths may be operated for 4-20 weeks continuously without requiring fresh bath make-up (depending upon throughput). The PC-AUTO/Controller will automatically make accurate, proportional additions of PC-45R and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

Performance Features

  • PC-45S and PC-45R are designed to maintain consistent control of developing pH at make-up and during replenishment.
  • PC-45S and PC-45R are formulated with a unique hard water scale inhibitors that minimize hard water accumulation in conveyorized spray process equipment (including post rinse chambers) and its potential formation and/or redeposition onto panels.
  • PC-45S and PC-45R contain rinse aids to inhibit the coagulation of dissolved photopolymer and antifoam.
  • PC-45S and PC-45R are compatible with virtually all type of aqueous dry films and LPI solder masks.
  • PC-45R is stabilized, improving process consistency and reducing replenishment volume by as much as 40%.

 

PC-45S and PC-45R TWO-PART DEVELOPER


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Seacole Product Tags:

PC-450

PC-450 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. Unlike conventional stabilizers, the PC-Series stabilizers do significantly increase the pH of the solution and can be employed at concentrations high enough to obtain 15-20% more throughput using the same volume of chemistry.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with Seacole’s PC-AUTO/Controller and Dosing Device, the PC-Series Developer baths may be operated for 4-20 weeks continuously and without dumping (depending upon throughput). The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

Performance Features

  • PC-450 is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-450 is stabilized, improving process consistency and improving bath life up to 20%.

 

PC-450


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PC-450C

PC-450 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. PC-450C contains a chemical stabilizer and cleaner. This economical concentrate can also be employed in manual or automated replenishment systems.


Performance Features

  • PC-450C is formulated with a unique hard water scale inhibitor which will not dull fused solder during LPI solder mask processing.
  • PC-450C is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-450C is stabilized, improving process consistency and extending bath life up to 20%.
  • PC-450C is formulated with an advanced cleaner package inhibiting the redeposition of contaminants.

 

PC-450C


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Seacole Product Tags: , ,

PC-450CSG

PC-450CSG is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. PC-450CSG contains a chemical stabilizer, and hard water inhibitor. Unlike conventional hard water inhibitors, the inhibitor in PC-450CSG will not complex or chelate heavy metals, reducing waste treatment concerns. Additionally, the inhibitor will reduce dulling of fused solder in LPISM developing processes.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with Seacole’s PC-AUTO/Controller and Dosing Device, the PC-Series Developer Concentrates have been proven to increase bath life by 20% over conventional developers. The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

 

Performance Features

  • PC-450CSG is formulated with a unique hard water scale inhibitor which will not dull fused solder during LPI solder mask processing.
  • PC-450CSG is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-450CSG is stabilized, improving process consistency and improving bath life up to 20%.

 

PC-450CSG


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PC-640

PC-640 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. PC-640 contains a chemical stabilizer and optional cleaners. Unlike conventional stabilizers, the PC-Series stabilizers do significantly increase the pH of the solution, and thus can be employed at concentrations high enough to obtain 15-20% more throughput through the same volume of chemistry.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with Seacole’s PC-AUTO/Controller and Dosing Device, the PC-Series Developer baths may be operated for 4-20 weeks continuously and without dumping (depending upon throughput). The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

Performance Features

  • PC-640 is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-640 is stabilized, improving process consistency and improving bath life up to 20%.

 

PC-640


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PC-640C

PC-640C is a carbonate based, liquid developer concentrate formulated with an advanced cleaner package for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. PC-640C contains a chemical stabilizer and cleaner package. Unlike conventional stabilizers, the PC-Series stabilizers do significantly increase the pH of the solution, and thus can be employed at concentrations high enough to obtain 15-20% more throughput through the same volume of chemistry.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with Seacole’s PC-AUTO/Controller and Dosing Device, the PC-Series Developer baths may be operated for 4-20 weeks continuously and without dumping (depending upon throughput). The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

Performance Features

  • PC-640C is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-640C is stabilized, improving process consistency and improving bath life up to 20%.
  • PC-640C is formulated with an advanced cleaner package inhibiting the redepostion of contaminants.

 

PC-640C


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PC-750

PC-750 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks. PC-750 contains a chemical stabilizer. Unlike conventional stabilizers, the PC-Series stabilizers do significantly increase the pH of the solution, and thus can be employed at concentrations high enough to obtain 15-20% more throughput through the same volume of chemistry.

This economical concentrate can also be employed in manual or automated replenishment systems. When used in combination with Seacole’s PC-AUTO/Controller and Dosing Device, the PC-Series Developer baths may be operated for 4-20 weeks continuously and without dumping (depending upon throughput). The PC-AUTO/Controller will automatically make additions of developer concentrate and water, maintaining the pH at +/-0.02 pH units and the carbonate concentration at +/-0.03% by weight, resulting in predictable developing quality without adjusting the conveyor speed.

 

Performance Features

  • PC-750 is compatible with virtually all type of aqueous and semi aqueous dry films and LPI solder masks.
  • PC-750 is stabilized, improving process consistency and improving bath life up to 20%.

 

PC-750


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Cu/ETCH ME-35

Cu/ETCH ME-35 (ME-35) is a single component liquid, designed to provide optimum micro-roughening and cleaning of copper surfaces prior to photopolymer lamination, oxide, HASL, most final finish systems (including E-TIN 34 Solderable Immersion Tin), and electroless copper, direct metallization and/or copper electroplating processes. This stabilized formulation produces a uniformly clean and micro-roughened copper surface; promoting excellent post direct metallization dry film to copper adhesion and copper-to-copper adhesion prior to copper electroplating, without attacking palladium catalyst deposits in through holes and/or via. The product also produces an ideal copper surface improving uniform oxide formation and/or immersion/electroless deposition of tin over copper. ME-35 can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. Additionally, ME-35 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, simplifying waste treatment.

 

Performance Features

  • ME-35 was specifically designed to provide superior etch characteristics without undermining direct metallization films.
  • ME-35 is a single component liquid suitable for feed/bleed operation.
  • ME-35 can be operated within a wide range of temperatures and concentrations, assuring optimum copper micro roughening for most applications including HASL, alternative final finishes, oxide systems, and photopolymer lamination.
  • ME-35 will produce a uniform matte copper surface at etch rates as low as 20 micro-inches per minute.
  • ME-35 is suitable for use in spray or immersion applications.
  • ME-35 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, improving safety and reducing environmental impact.

 

Cu/ETCH ME-35


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Cu/ETCH ME-40A

Cu/ETCH ME-40 (ME-40) is a two component liquid, designed to provide optimum micro-roughening and cleaning of copper surfaces prior to photopolymer lamination, oxide, HASL, most final finish systems (including E-TIN 34 Solderable Immersion Tin), and electroless copper, direct metallization and/or copper electroplating processes. This unique formulation produces a uniformly clean and micro-roughened copper surface; promoting excellent post direct metallization dry film to copper adhesion and copper-to-copper adhesion prior to copper electroplating, without attacking direct metallization deposits. The product also produces an ideal copper surface improving uniform oxide formation and/or immersion/electroless deposition of tin over copper. ME-40 can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. Additionally, ME-40 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, simplifying waste treatment.

 

Performance Features

  • ME-40 was specifically designed to provide superior etch characteristics without undermining direct metallization films.
  • ME-40 can be operated within a wide range of temperatures and concentrations, assuring optimum copper micro roughening for most applications including HASL, alternative final finishes, oxide systems, and photopolymer lamination.
  • ME-40 will produce a uniform matte copper surface at etch rates as low as 20 micro-inches per minute.
  • ME-40 is suitable for use in spray or immersion applications.
  • ME-40 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, improving safety and reducing environmental impact.
  • ME-40 exhibits consistent etch rates at concentrations between 1-30 g/L copper.

 

Cu/ETCH ME-40A


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Cu/ETCH ME-40B

Cu/ETCH ME-40 (ME-40) is a two component liquid, designed to provide optimum micro-roughening and cleaning of copper surfaces prior to photopolymer lamination, oxide, HASL, most final finish systems (including E-TIN 34 Solderable Immersion Tin), and electroless copper, direct metallization and/or copper electroplating processes. This unique formulation produces a uniformly clean and micro-roughened copper surface; promoting excellent post direct metallization dry film to copper adhesion and copper-to-copper adhesion prior to copper electroplating, without attacking direct metallization deposits. The product also produces an ideal copper surface improving uniform oxide formation and/or immersion/electroless deposition of tin over copper. ME-40 can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. Additionally, ME-40 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, simplifying waste treatment.

Performance Features

  • ME-40 was specifically designed to provide superior etch characteristics without undermining direct metallization films.
  • ME-40 can be operated within a wide range of temperatures and concentrations, assuring optimum copper micro roughening for most applications including HASL, alternative final finishes, oxide systems, and photopolymer lamination.
  • ME-40 will produce a uniform matte copper surface at etch rates as low as 20 micro-inches per minute.
  • ME-40 is suitable for use in spray or immersion applications.
  • ME-40 does not contain ammonium or chromate compounds, chlorides, fluorides, or nitrates, improving safety and reducing environmental impact.
  • ME-40 exhibits consistent etch rates at concentrations between 1-30 g/L copper.

 

Cu/ETCH ME-40B


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Cu/ETCH ME-45

Cu/ETCH ME-45 is a highly stable, easy to operate copper microetchant. It is an excellent micro etch for use prior to dry film lamination, oxide coating, electroless plating or solder leveling. Long bath life can be obtained by replenishment based on simple chemical analysis. ME-45 can be operated in either immersion or spray equipment.


Performance Features

  • Highly Stable
  • Economical
  • Long Bath Life
  • Formulated for either Immersion or Spray Equipment

 

Cu/ETCH ME-45


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Cu/ETCH ME-1029

Cu/ETCH ME-1029 (ME-1029) is a low foaming, sprayable micro-etch. ME-1029 will clean and deoxidize bare copper printed circuit boards.


Performance Features

  • Low Foaming
  • Formulated for Spray Applications
  • Cleans and Deoxidizes Bare Copper

 

Cu/ETCH ME-1029


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RE/Gen CC-15

RE/Gen CC-Series Etchants are concentrated, buffered sodium chlorate solutions designed to economically and safely regenerate cupric chloride etching systems utilizing the VIS-U-ETCH automated replenishment system. The use of sodium chlorate versus chlorine gas as the regenerative oxidizer, provides several safety advantages; most important of which is the elimination of chlorine gas storage and reduced potential for chlorine gas generation during replenishment.


Performance Features

  • CC-SERIES ETCHANTS eliminate the need for chlorine gas storage, and when operated properly, significantly reduces the risk of generating chlorine gas.
  • In most processes, CC-SERIES ETCHANTS and the VIS-U-ETCH automated replenishment system are a drop-in replacement for chlorine gas systems.

 

RE/Gen CC-15


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RE/Gen CC-22

RE/Gen CC-Series Etchants are concentrated, buffered sodium chlorate solutions designed to economically and safely regenerate cupric chloride etching systems utilizing the VIS-U-ETCH automated replenishment system. The use of sodium chlorate versus chlorine gas as the regenerative oxidizer, provides several safety advantages; most important of which is the elimination of chlorine gas storage and reduced potential for chlorine gas generation during replenishment.


Performance Features

  • CC-SERIES ETCHANTS eliminate the need for chlorine gas storage, and when operated properly, significantly reduces the risk of generating chlorine gas.
  • In most processes, CC-SERIES ETCHANTS and the VIS-U-ETCH automated replenishment system are a drop-in replacement for chlorine gas systems.

 

RE/Gen CC-22


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RE/Gen CC-28

RE/Gen CC-Series Etchants are concentrated, buffered sodium chlorate solutions designed to economically and safely regenerate cupric chloride etching systems utilizing the VIS-U-ETCH automated replenishment system. The use of sodium chlorate versus chlorine gas as the regenerative oxidizer, provides several safety advantages; most important of which is the elimination of chlorine gas storage and reduced potential for chlorine gas generation during replenishment.


Performance Features

  • CC-SERIES ETCHANTS eliminate the need for chlorine gas storage, and when operated properly, significantly reduces the risk of generating chlorine gas.
  • In most processes, CC-SERIES ETCHANTS and the VIS-U-ETCH automated replenishment system are a drop-in replacement for chlorine gas systems.

 

RE/Gen CC-28


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Seacole Product Tags:

RE/Gen CC-40

RE/Gen CC-40 is a concentrated, stabilized, and buffered sodium chlorate solution designed to economically and safely regenerate cupric chloride etching systems utilizing the VIS-U-ETCH system and a secondary specific gravity control. The specific gravity controller utilizes water from the cupric etchant post rinse, thereby reducing rinse water volume requiring waste treatment. The use of sodium chlorate versus chlorine gas as the regenerative oxidizer, provides several safety advantages; most important of which is the elimination of chlorine gas storage and reduced potential for chlorine gas generation during replenishment.


Performance Features

  • RE-Gen CC-40 can be used in conjunction with standard ORP control systems, or with the VIS-U-ETCH combined with a specific gravity controller.
  • RE/Gen CC-40, when used as directed with the VIS-U-ETCH system, yields a working bath that operates at low acid (less than 0.04 N) improving edge factor, and copper concentration of 230 g/L (30 opg), which reduces the volume of bleed.
  • RE/Gen CC-40 eliminates the need for chlorine gas storage, and when operated properly, significantly reduces the risk of generating chlorine gas.
  • In most processes, RE/Gen CC-40 is a drop-in replacement for chlorine gas systems.

 

RE/Gen CC-40


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RE/Gen CC-45

RE/Gen CC-45 is a concentrated, buffered sodium chlorate solution designed to economically and safely regenerate cupric chloride etching systems. The use of sodium chlorate versus chlorine gas as the regenerative oxidizer, provides several safety advantages; most important of which is the elimination of chlorine gas storage. Additionally, sodium chlorate final etching systems can be operated at comparable speeds while improving the undercut or etch factor, compared to traditional chlorine gas system. Being a concentrated liquid, CC-45 is easier to handle than dry sodium chlorate and was designed for replenishment systems which employ an ORP controller, specific gravity controller, and specific ion electrode.

 

Performance Features

  • CC-45 eliminates the need for chlorine gas storage, and when operated properly, reduces the risk of chlorine gas exposure.
  • Cupric chloride etching solutions regenerated with CC-45 can be operated at comparable speeds to chlorine gas systems.
  • In most processes, RE/Gen CC-45 is a drop-in replacement for chlorine gas, requiring only minor equipment modification.

 

RE/Gen CC-45


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Equipment/Cleaner 20

EQUIPMENT/Cleaner 20 is a highly concentrated detergent designed specifically to remove chemical scale, hard water scale, dry film and LPISM residue, and anti-foam residue from automated developing and resist stripping equipment. It is employed at a concentration of 5-10% and recirculated through the manifold plumbing to assure removal of residue in hard to reach areas including unplugging and descaling nozzles.

When employed regularly as a means of preventative maintenance, EQUIPMENT/Cleaner 20 assures cleaner, more efficient developing and resist stripping and will reduce the discoloration of equipment due to dyes used in typical photopolymers.

 

Performance Features

  • EQUIPMENT/Cleaner 20 is extremely concentrated and is thus economical to use. With routing application, EQUIPMENT/Cleaner 20 can save hours of labor associated with manual cleaning and nozzle replacement.
  • EQUIPMENT/Cleaner 20 is effective at removing chemical and hard water scale, photopolymer and resist residue, and anti-foam residue in a single application.
  • EQUIPMENT/Cleaner 20 is compatible with most types of equipment and will not attack or soften elastomers.
  • EQUIPMENT/Cleaner 20 was formulated to be compatible with PC-Series Developer Concentrates and POLY/Solv RS-Series Resist Stripper Concentrates. After cleaning equipment sumps do not require rinsing prior to employing these chemistries.

 

Equipment/Cleaner 20


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Equipment/Cleaner 60

EQUIPMENT/Cleaner 60 is a concentrated acid cleaner designed for use in developers, resist strippers and other processing tanks. EQUIPMENT/Cleaner 60 is effective as part of a routine cleaning regimen and aids in the removal of soldermask developer residues, hard water scale, and carbonate residues. EQUIPMENT/Cleaner 60 can also be used to clean and passivate stainless steel tanks and equipment.

 

Performance Features

  • EQUIPMENT/Cleaner 60, once neutralized, is environmentally safe.
  • Easy to use liquid formula.
  • Hydrochloric Acid Free.
  • No hazardous fumes.

 

Equipment/Cleaner 60


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EQUIPMENT/Cleaner 70

EQUIPMENT/Cleaner 70 is a concentrated acid cleaner designed for use in developers, resist strippers and other processing tanks. EQUIPMENT/Cleaner 70 is effective as part of a routine cleaning regimen for the removal of soldermask developer residues, hard water scale, and carbonate residues. EQUIPMENT/Cleaner 70 can also be used to clean even the most stubborn residues that are built up in solder mask developer chambers.

Performance Features

  • EQUIPMENT/Cleaner 70, once neutralized, is environmentally safe.
  • Easy to use liquid formula.
  • Hydrochloric Acid Free.
  • Can be reused multiple times.

EQUIPMENT/Cleaner 70


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ANTI/Foam CR-98

ANTI/Foam CR-98 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM. ANTI/Foam CR-98 is especially effective with high pressure/high solution throughput equipment and was formulated to rinse completely without leaving residue on printed circuit board surfaces or processing equipment. Additionally, CR-98 is readily pumpable for easy automated addition to process sumps utilizing bellows, air diaphragm, or peristaltic pumps.

 

Performance Features

  • CR-98 does not contain silica, fumed silica, or silicone.
  • CR-98 can be employed in both developing and resist stripping applications.
  • CR-98 is extremely free-rinsing virtually eliminating residue on process equipment.
  • CR-98 exhibits a viscosity lower than water for easy and accurate automated additions with most types of pumping systems.

 

ANTI/Foam CR-98


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ANTI/Foam CR-98S

ANTI/Foam CR-98S is an organic defoamer used to eliminate foam that develops in spray chambers for the developing and stripping of photoresist. The gradual dissolving of resist into developing and stripping solutions causes the generation of foam from the agitation of the spray pressure, that can cause the sumps to foam over or even shut down the operation of the machine by a control interlock.

 

Performance Features

  • CR-98S leaves a clean copper surface.
  • CR-98S is chemically stable in alkaline solutions.
  • CR-98S is extremely free-rinsing virtually eliminating residue on process equipment.
  • CR-98S does not attack photo resist.
  • CR-98S can be employed in both developing and resist stripping applications.

 

ANTI/Foam CR-98S


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ANTI/Foam CR-99

ANTI/Foam CR-99 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM. ANTI/Foam CR-99 is especially effective with high pressure/high solution throughput equipment and was formulated to rinse completely without leaving residue on printed circuit board surfaces or processing equipment. Additionally, CR-99 is readily pumpable for easy automated addition to process sumps utilizing bellows, air diaphragm, or peristaltic pumps.

 

Performance Features

  • CR-99 does not contain silica, fumed silica, or silicone.
  • CR-99 can be employed in both developing and resist stripping applications.
  • CR-99 is extremely free-rinsing, virtually eliminating residue on process equipment.
  • CR-99 exhibits a viscosity lower than water for easy and accurate automated additions with most types of pumping systems.

 

ANTI/Foam CR-99


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ANTI/Foam CR-D

ANTI/Foam CR-D is a non-silicon foam control agent formulated to inhibit foaming associated with photopolymer developing and stripping. It disperses extremely quickly in aqueous applications for improved antifoam performance.

 

Performance Features

  • CR-D does not contain silica, fumed silica, or silicone.
  • CR-D can be employed in both developing and resist stripping applications.
  • CR-D is compatible with nearly all types of plastics and elastomers.
  • CR-D is free-rinsing virtually eliminating residue on process equipment.

 

ANTI/Foam CR-D


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ANTI/Foam CR-W

ANTI/Foam CR-W is a concentrated aqueous emulsion of unique defoaming and foam preventing materials. This economical silicon based emulsion can be used in a wide variety of waste treatment applications; as its performance is not affected by acidic, basic, or high temperature environments. It disperses extremely well in aqueous applications, performing as an effective wetting agent and surface tension depressant for optimum defoaming performance.

 

Performance Features

  • CR-W performs equally well in acidic, basic, and high temperature environments.CR-W is a highly concentrated formulation minimizing consumption volume.
  • CR-W is non-corrosive, nonflammable, and safe and easy to employ.
  • CR-W will not interfere with ion exchange, clarification, or batch waste treatment systems.
  • CR-W is ideal for use in continuous flow waste treatment systems.

 

ANTI/Foam CR-W


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ENVIRO/Flow HAL-10

ENVIRO/Flow HAL-10 (HAL-10) is a medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. HAL-10 will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-10 will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-10 is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators which could attack solder mask or the laminate buttercoat.

 

Performance Features

  • Removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
  • Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
  • Completely water soluble and free rinsing.
  • Low acid formulation minimizing equipment wear.
  • Does not contain glycol ethers or activators which could attack soldermask or laminate.

 

ENVIRO/Flow HAL-10


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ENVIRO/Flow HAL-30

ENVIRO/Flow HAL-30 (HAL-30) is a low – medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. HAL-30 will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-30 will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-30 is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators which could attack solder mask or the laminate buttercoat.



Performance Features

  • ENVIRO/Flow HAL-30 removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
  • ENVIRO/Flow HAL-30 reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
  • ENVIRO/Flow HAL-30 is completely water soluble and free rinsing.
  • ENVIRO/Flow HAL-30 is a low acid formulation minimizing equipment wear.
  • ENVIRO/Flow HAL-30 does not contain glycol ethers or activators which could attack soldermask or laminate.

 

ENVIRO/Flow HAL-30


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ENVIRO/Flow HAL-31

ENVIRO/Flow HAL-31 (HAL-31) is a high viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards processed through vertical hot air leveling equipment such as AvalonTM, PentaTM, and QuicksilverTM. HAL-31 will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-31 will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-31 is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators which could attack solder mask or the laminate buttercoat.


Performance Features

  • ENVIRO/Flow HAL-31 removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
  • ENVIRO/Flow HAL-31 reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
  • ENVIRO/Flow HAL-31 is completely water soluble and free rinsing.
  • ENVIRO/Flow HAL-31 is a low acid formulation minimizing equipment wear.
  • ENVIRO/Flow HAL-31 does not contain glycol ethers or activators which could attack soldermask or laminate.

 

ENVIRO/Flow HAL-31


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ENVIRO/Flow HAL-40

ENVIRO/Flow HAL-40 (HAL-40) is a medium – high viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards processed through ArgusTM vertical hot air leveling equipment. HAL-40 will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-40 will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-40 is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators which could attack solder mask or the laminate buttercoat.

 

Performance Features

  • ENVIRO/Flow HAL-40 removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
  • ENVIRO/Flow HAL-40 reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
  • ENVIRO/Flow HAL-40 is completely water soluble and free rinsing.
  • ENVIRO/Flow HAL-40 is a low acid formulation minimizing equipment wear.
  • ENVIRO/Flow HAL-40 does not contain glycol ethers or activators which could attack soldermask or laminate.

 

ENVIRO/Flow HAL-40


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ENVIRO/Flow HAL-40LV

ENVIRO/Flow HAL-40 LV (HAL-40 LV) is a modified version of HAL-40, exhibiting a slightly lower viscosity to improve copper coverage on very small features. Like its counterpart, HAL-40 LV is designed to assure rapid and complete soldering of printed wiring boards processed through ArgusTM vertical hot air leveling equipment. ENVIRO/Flow HAL-40 LV will remove light copper oxides, deposit a non-evaporating protective film on the copper to minimize copper reoxidation prior to solder leveling, maximize solder wetting of the copper by reducing the surface tension at the copper/solder interface, and enhance the reflectivity of the solder finish. Additionally, HAL-40 LV will reduce solder adhesion to the laminate and/or soldermask, minimizing solder tailings and/or webbing sometimes encountered during hot air leveling. HAL-40 LV is COMPLETELY water soluble, low foaming, free rinsing, and contains no glycol ethers, solvents, or activators that could attack solder mask or the laminate buttercoat.

Performance Features

  • HAL-40 LV removes copper oxides and deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface.
  • HAL-40 LV is a lower viscosity version of HAL-40, to ease flux application on printed circuit boards exhibiting very small features, thereby improve coverage and minimize tailings.
  • HAL-40 LV reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing.
  • HAL-40 LV is a low acid formulation minimizing equipment wear.

 

ENVIRO/Flow HAL-40LV


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ENVIRO/Flow HAL-54

ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. HAL-54 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderabliity of copper pads. HAL-54 will provide a bright uniform solder finish with good rinsability. HAL-54 is a solvent free flux, non-foaming formulation that is compatible with LPI and dry film soldermasks.

 

Performance Features

  • Removes light copper oxides
  • Protects soldermask
  • Promotes excellent solderability of copper pads.

 

ENVIRO/Flow HAL-54


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ENVIRO/Flow HO-10

ENVIRO/Flow HO-10 (HO-10) is a low foaming, water-soluble, non-petroleum based, heat transfer fluid for use in immersion fusing of tin-lead plated printed wiring boards. It exhibits high temperature stability, thermal conductivity, and excellent water solubility for improved rinsing. HO-10 will produce a uniform and highly solderable finish on single-sided, double-sided, and plated through hole printed wiring boards.

Additionally, spent HO-10 can be beneficially reused as a secondary fuel, eliminating in-house waste treatment or expensive off-site hazardous waste land filling.

 

Performance Features

  • Excellent thermal stability and conductivity for consistent performance and improved operating life.
  • Excellent rinseability, even at ambient rinse water temperatures, initially, and as the product ages.
  • Recyclable and when spent can be reused as a secondary fuel eliminating in-house waste treatment or expensive off-site hazardous waste land filling

 

ENVIRO/Flow HO-10


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ENVIRO/Flow HO-30

ENVIRO/Flow HO-30 (HO-30) is an economical, low foaming, water-soluble, non-petroleum based, heat transfer fluid for use in immersion fusing of tin-lead plated printed wiring boards. It exhibits high temperature stability, thermal conductivity, and excellent water solubility for improved rinsing. HO-30 will produce a uniform and highly solderable finish on single-sided, double-sided, and plated through hole printed wiring boards.


Performance Features

  • ENVIRO/Flow HO-30 exhibits excellent thermal stability and conductivity for consistent performance and improved operating life.
  • ENVIRO/Flow HO-30 exhibits good rinseability, even at ambient rinse water temperatures, initially, and as the product ages.
  • ENVIRO/Flow HO-30 is recyclable, and when spent can be reused as a secondary fuel eliminating in-house waste treatment or expensive off-site hazardous waste land filling.

 

ENVIRO/Flow HO-30


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ENVIRO/Flow HO-50NF

ENVIRO/Flow HO-50NF (HO-50NF) is an economical, low foaming, water-soluble, non-petroleum based, heat transfer fluid for use in immersion fusing of tin-lead plated printed wiring boards. It exhibits high temperature stability, and thermal conductivity, and excellent water solubility for improved rinsing. HO-50NF will produce a uniform and highly solderable finish on single-sided, double-sided, and plated through hole printed wiring boards.