ENVIRO/Strip Cu | Seacole

ENVIRO/Strip Cu

ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications. Depending upon use, ENVIRO/Strip Cu is capable of stripping up to 150 g/L (20 opg) total metal with minimal precipitate formation. ENVIRO/Strip Cu is equally effective stripping plated or fused solder. Additionally, the copper inhibitor package minimizes copper attack, leaving a uniformly clean and bright copper surface, improving AOI inspection; and virtually eliminating the potential for solution exotherm. ENVIRO/Strip Cu is suitable for feed and bleed replenishment.


Performance Features

  • High throughput yields while minimizing precipitate (sludging) formation.
  • ENVIRO/Strip Cu is designed to be operated in spray application and is suitable for feed and bleed replenishment.
  • ENVIRO/Strip Cu exhibits minimal copper attack, improving process latitude and copper appearance after stripping.

 

ENVIRO/Strip Cu