ACTI/Plate DM-50 Catalyst (DM-50) is a specially formulated and concentrated tin/palladium colloidal catalyst suspension which absorbs onto non-conductive surfaces (properly conditioned in DM-10 Cleaner/Conditioner) rendering them suitably conductive for subsequent copper electroplating procedures. ACTI/Plate DM-50 forms a dense, highly conductive and stable deposit on both glass and epoxy surfaces; including dysfunctional, multifunctional, polyimide, and Teflon substrates.
Performance Features
- ACTI/Plate DM-50 may be used effectively on a wide variety of laminate systems.
- ACTI/Plate DM-50 is an acid free formulation, reducing equipment wear and improving ease of use.
- ACTI/Plate DM-50 forms a dense, conductive and stable deposit in a single pass; allowing for photo processing without copper flash plating.
- ACTI/Plate DM-50 offers a wide operating window, allowing for additions to be on a square foot basis without frequent laboratory testing.