Solderon BP TS 4000 Matte Tin/Silver | Seacole

Solderon BP TS 4000 Matte Tin/Silver

Solderon BP TS 4000 Matte Tin/Silver bump plating bath is a low-foaming, organic sulfonate-based electrolyte for the high-speed deposition of uniform, fine-grain, matte tin/silver alloy coatings.

Solderon BP TS 4000 Matte Tin/Silver bath is specifically designed for use in a semiconductor wafer plating process, producing fine-grained, smooth, solderable reflowed solder bumps with consistent alloy compositions.

Product Features

  • Environmentally-friendly, lead-free coating
  • Completely void-free reflow performance
  • Uniform deposit thickness and composition
  • Uniform deposit appearance
  • Low-foaming and stable electrolyte
  • Excellent reflowed bump morphology
  • Compatible with both horizontal and vertical plating equipment
  • Suitable for both in-via and mushroom deposition
  • High deposition rates
  • Ease-of-process control

Link to Dow Solderon BP TS 4000 Matte Tin/Silver