Aurolectroless SMT 520 Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The Aurolectroless SMT 520 Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.
- Lower gold content substantially reduces operating costs
- Flexible and easy gold thickness control
- Excellent solderability
Link to Dow Aurolectroless SMT 520 Immersion Gold