Solderon MHS-W is a high-speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in reel-to-reel wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems.
The components of the Solderon MHS-W are stable and soluble in the electrolyte at elevated temperatures, which allows for operation at higher cathodic current densities of operation. Uniform pure tin and tin-lead alloy deposits, which exhibit excellent solderability and fusing characteristics, are obtainable over a wide current density range.
- Based on biodegradable acid, effluent treatment can be readily achieved with standard neutralization and filtration procedures
- Non-foaming electrolyte
- High achievable deposition rates
- Excellent thickness distribution and alloy stability over a wide current density range.