Dow Solderon BTD

Solderon BTD is a low-foaming electroplating process for the high speed deposition of bright tin and tin-lead alloys from a non-fluoborate electrolyte.

The Solderon BTD system is designed for use in the high-speed reel-to-reel selective electroplating of connector components with tin and high tin-lead alloy (>80% tin) coatings.

Product Features

  • Very low-foaming electrolyte.
  • High cathode efficiency, which minimizes the problem of poor definition caused by stable cathodic foam in controlled depth cell electrodeposition
  • Exceptional solderability and performance.

Link to Dow Solderon BTD


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