Dow Solderon ST-200

Solderon ST-200 is a low-foaming, organic sulfonate electroplating process for the high-and low-speed deposition of uniform, large, well-polygonized grain tin deposits.

Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low-speed plating applications.

Product Features

  • Environmentally-friendly, lead-free coating
  • Low stress
  • Large grain size keep well polygonized
  • Excellent solderability
  • Low-foaming electrolyte
  • Uniform, satin-matte deposit appearance

Link to Dow Solderon ST-200


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