Solderon ST-200 is a low-foaming, organic sulfonate electroplating process for the high-and low-speed deposition of uniform, large, well-polygonized grain tin deposits.
Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low-speed plating applications.
- Environmentally-friendly, lead-free coating
- Low stress
- Large grain size keep well polygonized
- Excellent solderability
- Low-foaming electrolyte
- Uniform, satin-matte deposit appearance