Rohm and Haas Electronic Materials Nikal MP-200 (SE) offers numerous advantages of precision high-speed nickel plating in the electronic, printed circuit and allied fields where low or controlled stress, ductility and good color are desired. The bath has been particularly designed for operation in automated tab plating equipment. Available either in Sulfate Nickel or Sulfamate Nickel versions, the process is characterized by simplicity of operation and high tolderance to metallic impurities. Excellent as an underplate for gold, rhodium and solder.
- Bright ductile deposits with low porosity and slight tendency to leveling.
- Color uniform over with range of current densities.
- Approximate hardness of 500 VPN, increasing with higher additive concentration.
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