The Tinglo Culmo Process offers extremely bright tin deposits with excellent solderability and ductility, capable of meeting the requirements for electronic, industrial and decorative applications. The process is distinguished by its stability, economy, easy of operation and exceptional throwing power.
- Bright, leveled deposit
- Good solderability after long periods of storage
- Relatively non-porous deposit
- Meets Mil T-10727A for corrosion protection (salt spray)
- Economy and ease of use
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