Dow Solderon BT-280 | Seacole

Dow Solderon BT-280

Solderon BT-280 is a high-speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BT-280 electrolyte gives bright deposit over a wide range of current density. Its proprietary formulation controls both grain size and grain orientation which results in a stable deposit. The additive system also plates bright Sn finish with minimum organic inclusions. Simple analytical procedures are available for all products in the process.

Product Features

  • High deposition rates leading to high throughput values
  • Produce excellent brightness and solderability
  • Low carbon content in the deposit
  • Low foaming electrolyte
  • Consistent and stable surface morphology
  • White foam line, which allows partial plating or control depth plating