Solderon SC is a low-foaming, organic sulfonate electroplating for the high-speed deposition of uniform, fine-grain, matte tin an tin/lead alloy coatings.
Solderon SC is specially designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector applications.
- Very low-foaming electrolyte
- Extremely stable alloy and thickness distribution across the operating current density range
- Outstanding performance at high current densities
- Uniform deposit appearance
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