ENVIRO/Flow HO-30 (HO-30) is an economical, low foaming, water-soluble, non-petroleum based, heat transfer fluid for use in immersion fusing of tin-lead plated printed wiring boards. It exhibits high temperature stability, thermal conductivity, and excellent water solubility for improved rinsing. HO-30 will produce a uniform and highly solderable finish on single-sided, double-sided, and plated through hole printed wiring boards.
- ENVIRO/Flow HO-30 exhibits excellent thermal stability and conductivity for consistent performance and improved operating life.
- ENVIRO/Flow HO-30 exhibits good rinseability, even at ambient rinse water temperatures, initially, and as the product ages.
- ENVIRO/Flow HO-30 is recyclable, and when spent can be reused as a secondary fuel eliminating in-house waste treatment or expensive off-site hazardous waste land filling.