Dow Tinposit LF Immersion Tin | Seacole

Dow Tinposit LF Immersion Tin

Tinposit LF Immersion Tin is an immersion tin formulation producing uniform and solderable tin deposits on properly prepared PWB substrates. Tinposit LF Immersion Tin is specifically formulated to be used in lead-free assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit LF Immersion Tin bath is easy to control and has a high tolerance for contaminants.

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