Seacole is proud of its long-time partnership with leading chemical product manufacturing DuPont. An industry leader, DuPont has earned its reputation as a manufacturer of high-performance, reliable, and effective chemistries for a wide range of end applications, including metal finishing processes.
Solderon™ MHW-W for Wire Plating
DuPont’s Solderon™ MHS-W is a high-speed, non-foaming electroplating product for the rapid deposition of fine-grain, matte tin, and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in reel-to-reel wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems.
Solderon™ MHS-W is based on a biodegradable acid. It is non-foaming and non-fluoborate. Its excellent thickness distribution and alloy stability over a wide current density range enables highly achievable deposition rates.
Ronaclean™ E 950 LF for Wire Plating
Ronaclean™ E 950 LF is an economical, low-foaming, high-detergent alkaline cleaner especially designed for high-speed applications in printed circuit board manufacturing processes. It offers excellent primary cleaning of most metals due to its low-foaming and high detergency properties. Ronaclean™ E 950 LF is compatible with hard water and non-chelated for simple wastewater treatment.
Ronaclean™ 500 for Wire Plating
DuPont’s Ronaclean™ 500 is a liquid alkaline cleaner designed to degrease and clean contaminated surfaces of iron, steel, copper, and copper alloys. It can be used as a soak cleaner or as an electrolytic degreaser capable of removing oils and lubricants, such as cutting fluids used in machining and metal forming.
Ronaclean™ 500 is ready for immediate use, with no need to dissolve salts. It will not cause particles to stick to tanks, pumps, or recuperators.
Solderon™ BHT-350 Bright Tin for Connector Plating
Solderon™ BHT-350 Bright Tin is a high-speed, sulphonate–based tin electroplating product formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. Solderon™ BHT-350 Bright Tin electrolyte is free of volatile aldehydes and may be operated at temperatures up to 50°C.
By operating at high temperatures, Solderon™ BHT-350 Bright Tin enables high plating rates and reduces volume increase. It offers consistent and stable surface morphology with low carbon content in the deposit. This low-foaming electrolyte produces excellent brightness and solderability over a broad current density range.
Ronovel™ CM Cobalt-Alloyed Electrolytic Gold for Connector Plating
Ronovel™ CM Cobalt-Alloyed Electrolytic Gold utilizes a unique chelate system that prevents the oxidation of cobalt and substantially reduces the variation in cobalt co-deposition. By adjusting operating parameters, processes can be calibrated to suit different plating heads and cells.
Ronovel™ CM Cobalt-Alloyed Electrolytic Gold is designed for low- and high-speed plating applications, including reel-to-reel connector, stripe or strip, automatic printed circuit tab, deep tank circuit, and barrel plating. Ronovel™ CM Cobalt-Alloyed Electrolytic Gold should be used where a highly even thickness distribution across the plated part is desired.